Smoothing effect of the thermal interface material on the temperature distribution in a stepwise varying width microchannel cooling device

Development of one-section microchannels cooling system for high-concentration photovoltaic cells

“…Changes in the microchannel thermal resistance and the pumping power for various TIMs are negligible. The increase in standard deviation as the thermal conductivity increases is in agreement with the finding reported by Riera et al [40]. Thus, the use of the advanced TIM with k=4W/mK enhances the performance and characteristics of the cooling system over those with TIM of k=0.82W/mK substantially.…”

“…Also, the system achieved a lower microchannel thermal resistance of 2.35×10 -5 m 2 K/W. The TIM affects the temperature distribution by its smoothing effect and the temperature uniformity improved by decreasing the smoothing resistance [40]. Finally, Vilarrubi et al [41] replaced the ordinary stepwise microchannels by variable density micro pin-fins that provided the same trend of total thermal resistance as ordinary microchannels.…”

An Overall-Optimized Heat Dissipation Enhancement Design Scheme for Automation Systems Based on Microchannel Units and the Evaluation of Heat Dissipation Performance

“…Compared with the conventional regular-sized channel heat sinks, microchannel heat sinks have been more widely used in the cooling, heat exchange, and thermal control modules of automation devices [7][8][9][10][11][12] due to their many merits such as high efficiency of heat exchange, energy-saving, and can make full use of the sensible and latent heat. Compared with air-cooled heat exchangers whose heat dissipation performance is greatly limited by the thermal and physical properties of the air, microchannel heat sinks have better heat transfer and isothermal performance [13][14][15][16][17][18][19][20][21][22][23][24]. To achieve higher efficiency of heat dissipation, the design of heat dissipation enhancement of automation systems from an overall optimization scale based on microchannel units has received more attention in both academic circle and the industry, and it is of great research value to explore the laws of enhanced heat dissipation in the microchannel units of automation systems.…”

Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics

“…Indeed, large temperature gradients in the package increase thermal stresses in the heat sink interface, reduce electronic reliability in high temperature regions and create circuit imbalances in CMOS devices [7]. Some studies have focused on reducing chip temperature nonuniformity under a uniform heat flux map, including the use of flow boiling of dielectric liquid [8], single phase liquid cooling with variable pin fin density [9], variable microchannel width in the streamwise direction [10][11][12] and double-layer microchannel structures [13]. Hybrid jet impingement/microchannel cooling schemes have shown their capacity to provide low thermal resistances, good temperature uniformities and lower pressure drops than conventional microchannel devices for specific heat flux distributions [14,15].…”