SmartHeating: On the Performance and Lifetime Improvement of Self-Healing SSDs

Cui, Jinhua; Liu, Junwei; Huang, Jianhang; Yang, Laurence T.

doi:10.1109/tcad.2020.2990896

Cited by 10 publications

(2 citation statements)

References 39 publications

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“…Because SSDsim has a diverse set of conigurations, it has been widely employed in many studies for measuring SSD performance through running simulation tests [28]. [29,30]. In the evaluation tests, we did emulate a DRAM-less SSD device (64GB and 128GB) that does not hold a speciic cache for bufering the write data [31].…”

Section: Methodsmentioning

confidence: 99%

Degraded Mode-benefited I/O Scheduling to Ensure I/O Responsiveness in RAID-enabled SSDs

Sha

Cai

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

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RAID-enabled SSDs commonly have unbalanced I/O workloads on their components (e.g. SSD channels), as the data/parity chunks in the same stripe may have varied access frequency, which greatly impacts I/O responsiveness. This paper proposes a I/O scheduling scheme by resorting to the degraded read mode and the read-modify-write mode, to reduce the long-tail latency of I/O requests in RAID-enabled SSDs. The basic idea is to avoid scheduling read or update requests to the heavily congested but targeted RAID components. Such requests are satisfied by accessing other relevant RAID components by certain XOR computations (we call the degraded modes ). Specially, we build a queuing overhead assessment model on the top of factors of data redundancy and the current blocked I/O traffics on SSD channels, to precisely dispatch incoming I/O requests to be fulfilled with the degraded mode or not. The trace-driven experiments illustrate that the proposed scheme can reduce the long-tail latency of read requests by 23.1% on average at the 99.99th percentile, in contrast to state-of-the-art scheduling methods.

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Section: Methodsmentioning

confidence: 99%

Degraded Mode-benefited I/O Scheduling to Ensure I/O Responsiveness in RAID-enabled SSDs

Sha

Cai

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

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“…Control unit juga bertindak sebagai perantara untuk mengubah instruksi yang dikirim ke prosesor dan memberikan sinyal kontrol ke unit lain seperti unit aritmatika dan logika untuk memberitahu apa yang harus dilakukan serta memproses data yang diproses dan dikirim kembali ke memori. Jika CPU bekerja sangat keras maka memory juga akan menerima beban tersebut yang akan mengakibatkan memori overheat [5][6][7][8] . Alasan inilah yang menjadi masalah utama kenapa memori tipe SSD juga harus diberikan heat sink untuk mengurangi panas yang dihasilkan dari beban komputasi yang dihasilkan CPU.…”

Section: Pendahuluanunclassified

Pengaruh Geometri Dan Penambahan Jumlah Sirip Terhadap Distribusi Temperatur Heat Sink Sebagai Alternatif Pendinginan Pada Piranti Elektronik

Subekti,

Wahyudi,

Gapsari

2023

JRM

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This study aims to determine the effect of the geometry shape of the copper material heat sink fins on the surface temperature distribution of the heat sink. The material used in this research is pure copper, the shape of the heat sink fins is made rippled with the addition of the number of fins 5, 6, and 7 and the input temperature is varied from 40 C to 80 C with airflow variations from 0.2 m/s to 1 m/s. The first step is to create a heat sink design with Autodesk Inventor. Then the plan is simulated with Autodesk CFD to solve the continuity, momentum, turbulence, and energy equations. Based on the method that has been carried out, it is found that the addition of variations in the number of fins affects the decrease in surface temperature. The highest temperature drop on fin 5 ripples is 24.1 C. The heat energy transfer rate increased by 0.4657 W. The convection heat transfer coefficient increased by 3.47 W/m²C. Nusselt number shows an increase of 271. Fin performance has increased efficiency by 63.4 %, and effectiveness by 1.61. The results of this study are expected to provide practical alternatives that can be widely adopted on a heatsink plate that is very promising for future thermal developments.

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