The development of smart reactive materials is of significant interest to the reactives community in order to tailor energy delivery and enable ON/OFF capability. Of the polymer bound reactives, those with fluoropolymer binder have shown potential as smart materials due to the polymer's strong electroactive characteristics. This could be due to piezoelectricity or flexoelectricity but has not been well characterized. This effort measures the flexoelectric coefficient for two fluoropolymer/aluminium (Al) reactive systems and details the role processing, configuration and fluoropolymer type have on their electroactive behavior. Specifically, poly(vinylidene fluoride) (PVDF) and tetrafluoroethylene‐hexafluoropropylene‐vinylidene fluoride (THV) were characterized with Al (fuel) loadings of 0, 20, 33 and 50 wt%. Two additive manufacturing routes, direct ink writing (DIW) and fused filament fabrication, were used to determine how processing and print direction may influence the electroactive behavior. A linear increase in flexoelectric coefficient as a function of Al loading was observed for both fluoropolymer systems ranging from 5.03 ± 0.7 nC m–1 to 7.83 ± 1.1 nC m–1. Processing via DIW resulted in samples with the highest flexoelectric coefficients, 8.48 ± 1.0 and 11.62 ± 2.5 nC m–1 for THV/Al and PVDF/Al, respectively, attributed to increased porosity. These results indicate that non‐piezoelectric polymer bound reactives have promise as smart reactives with calculated apparent piezoelectric coefficients up to 189 ± 12 pC N–1. © 2021 Society of Industrial Chemistry.