Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
DOI: 10.1109/itherm.2006.1645421
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Small scale refrigeration system for electronics cooling within a notebook computer

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Cited by 39 publications
(43 citation statements)
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“…Chiriac and Chiriac (2008) concurred with this assessment in a recent review. Other investigations into refrigeration technology have led to the development of system prototypes (Mongia et al, 2006) and system-level models such as ones by Heydari (2002) and Possamai et al (2008).…”
Section: Introductionmentioning
confidence: 99%
“…Chiriac and Chiriac (2008) concurred with this assessment in a recent review. Other investigations into refrigeration technology have led to the development of system prototypes (Mongia et al, 2006) and system-level models such as ones by Heydari (2002) and Possamai et al (2008).…”
Section: Introductionmentioning
confidence: 99%
“…In particular, as will be evident from the detailed review of the literature presented here, very limited attention has been directed towards details of the influence of thermodynamic vapor quality on the heat transfer coefficient in microchannels. Knowledge of the flow boiling heat transfer coefficient as a function of vapor quality is essential in applications such as vapor compression-based refrigeration, which has been shown to be an effective means for cooling electronics [21][22][23]. All of the refrigerant liquid stream goes through a change of phase to the vapor state in such systems.…”
Section: Introductionmentioning
confidence: 99%
“…In contrast, refrigeration with vapor compression systems [12,13,14] has received less attention even though it has been shown to be an effective means for lowering the coolant temperature, and therefore, maintaining acceptable device temperatures when dissipating high heat fluxes. The primary advantages of small-scale vapor compression systems are the possibility of achieving fluid temperatures below ambient, a lower freezing point compared to water, and compatibility with electronic circuits in case of leakage due to their higher dielectric strength.…”
Section: Introductionmentioning
confidence: 99%