1970
DOI: 10.1063/1.1653336
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SMALL-AREA HIGH-CURRENT-DENSITY GaAs ELECTROLUMINESCENT DIODES AND A METHOD OF OPERATION FOR IMPROVED DEGRADATION CHARACTERISTICS

Abstract: Diffused-junction GaAs electroluminescent diodes of small area and high radiance have been fabricated. It has been observed (1) that the degradation of these high-current-density cw diodes can be reduced greatly by superimposing a periodic reverse-bias pulse on the normal dc forward bias, and (2) that a previously degraded diode is restored to its initial light output by the influence of the built-in junction fields, or an applied dc reverse bias, at an elevated temperature.

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Cited by 55 publications
(11 citation statements)
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“…Light emitting diodes (LEDs) have been intensively investigated since Burrus [1] fabricated the first LED for optical fiber communication systems. LEDs with high luminous and energy efficiencies compared to traditional light sources of incandescence and fluorescence, color rendering, reduced size and lower cost are currently being adopted in a wide range of applications.…”
Section: Introductionmentioning
confidence: 99%
“…Light emitting diodes (LEDs) have been intensively investigated since Burrus [1] fabricated the first LED for optical fiber communication systems. LEDs with high luminous and energy efficiencies compared to traditional light sources of incandescence and fluorescence, color rendering, reduced size and lower cost are currently being adopted in a wide range of applications.…”
Section: Introductionmentioning
confidence: 99%
“…However, it did not initially find application because the life expectancy was then only a few hundred hours at most. The "Burns Diode," also announced in 1970 [21,22,23], was capable of emitting power on the order of 10 mW from an area roughly 10 microns in diameter. It also coupled well into a single fiber and by 1972 had already demonstrated a life expectancy of several thousand hours [24].…”
Section: Dmentioning
confidence: 99%
“…This is done at a point approximately 300 pm above the chip surface, where both the cladding and the protective jacket of the fiber are still intact. No adhesive is needed at the surface of the chip, as in other fiber-optic coupler designs [4]- [7] because the detector cavity itself prevents any lateral misalignment. The package configuration is stable enough that no fiber has yet pulled out of a detector cavity during testing once it has been bonded to the slide.…”
Section: Device Fabricationmentioning
confidence: 99%
“…These applications would require a means of coupling a large number of fibers to a single semiconductor chip, but no standard technique to satisfactorily perform this function now exists. Techniques employing lens elements [3], a Bums-type structure [4], or simple butt-coupling [5], which have been used for coupling fibers to discrete optoelectronic components, require too much space to be useful in VLSI interconnection schemes. A recently reported hybrid approach [6], using silicon V-grooves to guide fibers into an integrated 12 X 1 photodiode array, would place restrictions on detector placement as well as presenting assembly and stability problems typically as- JR., SENIOR MEMBER, IEEE sociated with hybridization.…”
Section: Introductionmentioning
confidence: 99%