SMA microgripper with integrated antagonism

Kohl, Manfred; Just, Elmar; Pfleging, Wilhelm; Miyazaki, S.

doi:10.1016/s0924-4247(99)00385-4

Cited by 128 publications

(60 citation statements)

References 5 publications

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“…[1][2][3][4][5] Recently Ti-Ni SMA plates of 100 micrometers or less in thickness could be fabricated by the cold-rolling method. Thus, actuators with two-dimensionalshape such as diaphragms and multi-directional beam-cantilever type actuators have been fabricated.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, actuators with two-dimensionalshape such as diaphragms and multi-directional beam-cantilever type actuators have been fabricated. [5][6][7][8][9][10] The coldrolling process is industrially advantageous to fabricate binary Ti-Ni alloy thin plates in a limited compositional range. On the other hand, by using the melt-spinning technique, thinner Ti-Ni ribbons such as 15 micrometers in thickness can be fabricated in a wide compositional range as well as ternary Ti-Ni base alloys.…”

Section: Introductionmentioning

confidence: 99%

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Texture and Microstructure of Ti-Ni Melt-Spun Shape Memory Alloy Ribbons

2004

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The shape memory behavior, texture and microstructure were studied for Ti-Ni ribbons fabricated by a melt-spinning method where the Ni contents were designed to be 49.0 at%, 50.0 at% and 51.0 at%. The texture of the parent B2 phase was determined by X-ray diffraction pole figures. A strong h100i fiber texture was found in both pole figures and orientation distribution functions (ODF). TEM observation revealed that all the ribbons are fully crystallized and that disk-type precipitates of about 10 nm in length locate on {100} of B2 phase uniformly. The thermal cyclic tests under various constant stresses showed shape recoverable strains exceeding 5% and critical stresses for plastic deformation being higher than 400 MPa for Ti-49.0 at%Ni and Ti-50.0 at%Ni as-spun ribbons. These excellent shape memory characteristics of the melt-spun ribbons are due to the formation of these disk-type precipitates. In addition, Ti 2 Ni precipitates of 25 nm in diameter appeared along grain boundaries of Ti-51.0 at%Ni as-spun ribbon. Since the Ni content of the matrix is condensed due to the formation of Ti 2 Ni precipitates, no shape memory effect was observed in Ti-51.0 at%Ni as-spun ribbon under the experimental conditions.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Texture and Microstructure of Ti-Ni Melt-Spun Shape Memory Alloy Ribbons

2004

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“…Shape memory alloy actuators can produce large strokes. However, they can cycle only a few times before complete immobilization and have high fabrication costs, hysteresis, and short lifetime 17 .…”

Section: Introductionmentioning

confidence: 99%

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Liang

Wang

Tian

et al. 2015

Review of Scientific Instruments

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Placid. (2015) A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging. Review of Scientific Instruments, 86 (4). 045106. Permanent WRAP url: http://wrap.warwick.ac.uk/76447 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way. Publisher's statement:Copyright ( A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate and robust microelectronic device packaging. The wire clamp has compact flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and parallelogram leverage mechanism was designed. Pseudo-rigid-body model (PRBM) and Lagrange approaches were employed to conduct the kinematic, static and dynamic modeling of the wire clamp, and optimization design was carried out. The displacement amplification ratio, maximum allowable stress and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire Electro Discharge Machining (EDM) technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance, and the experimental results match well with the theoretical calculation and FEA.The amplification ratio of the clamp is 20.96, and the working mode frequency is 895 Hz.Step response test show the wire clamp has fast response and high accuracy, and the motion resolution is 0.2μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

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“…1) Especially the thin films with substrate are utilized in designing of devices with micrometer size, such as pumps, 2) valves 3,4) and grippers 5,6) etc., because the substrate such as silicon can be used as a bias-elastic element that makes the design more simple. In that case the residual stress can be found in the final thin film-substrate composite element, which will inevitably affect the performance of SMA thin film actuators.…”

Section: Introductionmentioning

confidence: 99%

Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer

Jiang

Xuan

et al. 2002

Mater. Trans.

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As micro-actuator materials, TiNi shape memory alloy thin films with substrate are used more and more in MEMS field. The residual stress in Ti-rich TiNi thin films with silicon substrate prepared by the magnetron-sputtering technique is measured by both X-ray glancing and contour method. The influence of crystallization annealing temperature and film thickness on the residual stress is tested. It is shown that the tensile residual stress decreases from 106 to 37 MPa with increasing annealing temperature from 723 to 923 K. However, it increases again above 1023 K. While increasing the film thickness from 2.4 to 6.5 µm, the residual stress reduces from 323 to 80 MPa. A lot of beautiful sunflower-like structures in crystal grains are observed by OM and TEM. The origin of the residual stress and its affecting factors are discussed. The thermal stress during cooling after annealing is the main factor resulting in tensile stress and the formation of martensite phase will release a part of tensile stress.

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SMA microgripper with integrated antagonism

Cited by 128 publications

References 5 publications

Texture and Microstructure of Ti-Ni Melt-Spun Shape Memory Alloy Ribbons

Texture and Microstructure of Ti-Ni Melt-Spun Shape Memory Alloy Ribbons

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Residual Stress of TiNi Shape Memory Alloy Thin Films with (111) Single-crystal Silicon Wafer

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