Sm-Co Thick Films Micromolding

Abstract

This paper presents a study of the scale effect occurring during electrodeposition in the (micro)molding process of a rare earth -transition metal alloy : SmCo. Different cathode sizes have been implemented in the electrodeposition set up: a large strip (10 cm × 1.5 cm), a matrix of 1 mm 2 square and matrix of 5-50 μm micropatterns. Results concerning composition, deposition rate, adherence and thickness uniformity of the patterns show an influence of the scale effect: the decreasing of the conductive surface of the cathode leads to thinner films containing less samarium, but also a lower oxygen content. Patterns are then free of cracks, more uniform in thickness and present a good adherence to the copper seed layer. The influence of the deposition time has been also studied for micromoulding process, showing an increase of the samarium content but a decrease of the deposition rate during the deposition.