2016
DOI: 10.1016/j.ceramint.2015.11.037
|View full text |Cite
|
Sign up to set email alerts
|

Slow crack growth behavior of silicon nitride ceramics in cryogenic environment

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2017
2017
2023
2023

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 21 publications
0
1
0
Order By: Relevance
“…The toughening mechanisms of the ZrO 2 whisker in the ceramic material are the whisker bridging and the crack deflection. During the whisker bridging and the crack deflection, the energy consumption occurs [40], which is conducive to enhancing the fracture toughness of the ceramic material.…”
Section: Mechanism Analysis Of Co-modification Of Micron Zro2 Whisker...mentioning
confidence: 99%
“…The toughening mechanisms of the ZrO 2 whisker in the ceramic material are the whisker bridging and the crack deflection. During the whisker bridging and the crack deflection, the energy consumption occurs [40], which is conducive to enhancing the fracture toughness of the ceramic material.…”
Section: Mechanism Analysis Of Co-modification Of Micron Zro2 Whisker...mentioning
confidence: 99%