1981
DOI: 10.1080/01418618108239395
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Sliding at twin boundaries during high-temperature creep

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1983
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Cited by 14 publications
(4 citation statements)
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“…Interfacial sliding can occur on growth defect (or annealing) twins (Wirmark et al 1981), which is consistent with present observations. The periodic arrangement of dislocations in the boundary observed in Figure 13d may be due to boundary movement (Pond et al 1978), to ledges caused by a deviation from an exact lattice coincidence or twin relationship across the boundary (Brandon 1966), or to boundary migration (Gleiter et al 1980;Ray & Smith 1980).…”
Section: Mechanical Behavioursupporting
confidence: 90%
“…Interfacial sliding can occur on growth defect (or annealing) twins (Wirmark et al 1981), which is consistent with present observations. The periodic arrangement of dislocations in the boundary observed in Figure 13d may be due to boundary movement (Pond et al 1978), to ledges caused by a deviation from an exact lattice coincidence or twin relationship across the boundary (Brandon 1966), or to boundary migration (Gleiter et al 1980;Ray & Smith 1980).…”
Section: Mechanical Behavioursupporting
confidence: 90%
“…Combined with MD simulations, TBS induced by full dislocations (extended dislocations) sliding on TB has been first revealed at atomic scale, contributed largely to the total strain in the early stage of deformation. Furthermore, direct evidence shows dislocations emitted from the twin boundary‐free surface junctions and from free surface further assist the plastic deformation and finally achieved a superplasticity of ≈166% in single crystalline copper nanowire comparing with the reported maximum strains less than 49% . Besides, a severe necking which is over 93% has also occurred.…”
mentioning
confidence: 72%
“…In most twin‐structured polycrystalline materials, the effect induced by TBS may be annihilated at grain boundaries. Furthermore, TBS, which has been only detected during high‐temperature creep may contribute a tiny friction to the total strain . Comparing with the elasticity which is critical to the strength of materials, less attention has been paid to the plasticity of nanoscale twin‐structured single crystalline materials.…”
mentioning
confidence: 99%
“…18 Our data are consistent with these observations on Sn-Ag-Cu, as well as with observations on other metals that grain boundary sliding is inhibited by the presence of boundaries with coincident site lattice orientations. 19 On the other hand, intermetallic compounds (IMC), if they play a significant role in the pinning of dislocations in Sn-Ag-Cu, could be the basis of a dislocation model to also explain our creep deformation data, either for the case of Ag that is uniformly distributed in small precipitates within the solder joint, or for the case where it is preferentially located at grain boundaries. In both cases, in the absence of significant grain boundary sliding, the dependence of creep resistance, 60 deg twins, and grain size on Ag reported here would be largely coincidental.…”
Section: Dynamic Chip Warpage Measurementsmentioning
confidence: 99%