“…On the other hand, when the used strain was 1%, G′ value increased sharply and immediately became bigger than G″, meaning the specimen returned to a gel state [ 47 ]. Meanwhile, G′ and G″ can restore to their initial values wholly without decrease after three repeated intervals, proving the remarkable self-healing capacity of CPAP/PDA@Cu [ 48 ]. Fig.…”
“…On the other hand, when the used strain was 1%, G′ value increased sharply and immediately became bigger than G″, meaning the specimen returned to a gel state [ 47 ]. Meanwhile, G′ and G″ can restore to their initial values wholly without decrease after three repeated intervals, proving the remarkable self-healing capacity of CPAP/PDA@Cu [ 48 ]. Fig.…”
“…Glycosaminoglycans are the major structural and bioactive components of human brain ECM [5b] , which are biocompatible, hydrophilic, largely non-immunogenic, and capable of scavenging reactive oxygen species [16] . Gelatin, as denatured collagen, also mimics the components of native brain ECM [17] and is suitable for tissue engineering and regenerative medicine due to its biocompatibility, biodegradability, promotion of blood coagulation, and promotion of cell adhesion and migration [18] . The introduction of catechol groups (dopamine, similar to mussel adhesion protein [19] ) in a hydrogel network can enhance the hydrogel’s hemostatic, antioxidant and adhesive properties [11] , and may have contributed to the HA-PBA/Gel-Dopa hydrogel’s hemostatic capacity ( Fig.…”
Brain lesions can arise from traumatic brain injury, infection, and craniotomy. Although injectable hydrogels show promise for promoting healing of lesions and health of surrounding tissue, enabling cellular ingrowth and restoring neural tissue continue to be challenging. We hypothesized that these challenges arise in part from viscoelastic mismatch between the hydrogel and the brain parenchyma, and tested this hypothesis by developing and evaluating a self-healing hydrogel that mimicked both the composition and viscoelasticity of native brain parenchyma. The hydrogel was crosslinked by dynamic boronate ester bonds between phenylboronic acid grafted hyaluronic acid (HA-PBA) and dopamine grafted gelatin (Gel-Dopa). This HA-PBA/Gel-Dopa hydrogel could be injected into a lesion cavity in a shear-thinning manner with rapid hemostasis, high tissue adhesion and efficient self-healing. We tested this in an in vivo mouse model of brain lesions and found the hydrogel to support neural cell infiltration, decrease astrogliosis and glial scars, and close the lesions. The results suggest a role for viscoelasticity in brain lesion healing, and motivate additional experimentation in larger animals as the technology progresses towards potential application in humans.
“…[367] Biologically derived structural polymers such as gelatin and collagen can be processed into films and used as substrates in bioelectronics. [369][370][371][372][373] Through the use of additives such as glycerol, citric acid, and glucose, Baumgartner et al process tough gelatin biogels that can accommodate strains of up to ε max = 300%. Conductive zinc traces were defined through laser patterning to fabricate a wearable sensor capable of moni toring a number of different parameters such as temperature, humidity, and strain.…”
Designing bioelectronic devices that seamlessly integrate with the human body is a technological pursuit of great importance. Bioelectronic medical devices that reliably and chronically interface with the body can advance neuroscience, health monitoring, diagnostics, and therapeutics. Recent major efforts focus on investigating strategies to fabricate flexible, stretchable, and soft electronic devices, and advances in materials chemistry have emerged as fundamental to the creation of the next generation of bioelectronics. This review summarizes contemporary advances and forthcoming technical challenges related to three principal components of bioelectronic devices: i) substrates and structural materials, ii) barrier and encapsulation materials, and iii) conductive materials. Through notable illustrations from the literature, integration and device fabrication strategies and associated challenges for each material class are highlighted.
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