2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018
DOI: 10.1109/icept.2018.8480689
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Size effect on the interfacial reaction and IMC growth of Sn–3.0Ag–0.5Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering

Xing-Fei Zhao
1
,
Min-Bo Zhou
2
,
Tao Lin Sun
3
et al.
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