Size-dependent melting properties of tin nanoparticles

Jiang, Hongjin; Moon, Kyoung‐Sik; Dong, Hai; Hua, Fay; Wong, Ching‐Ping

doi:10.1016/j.cplett.2006.08.027

Cited by 192 publications

(108 citation statements)

References 18 publications

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“…The similar jumplike dependence of heat flow on temperature in Sn nanoparticles with sizes of 26-85 nm was reported in Ref. 2 that was attributed to the melting of Sn nanoparticles. A jumplike increase in the electron-phonon scattering frequency was reported in Ref.…”

Section: -3supporting

confidence: 88%

“…[5][6][7][11][12][13] Experimental evidence of the decrease in T m has been demonstrated by a variety of techniques. 2,[14][15][16][17][18] In addition, the influence of surrounding matrix on T m has been demonstrated, e.g., in our previous work. 19 However, the influence of the interaction between the metal nanoparticles ͑or filling factor of nanocomposite͒ on their melting point is an unstudied problem.…”

Section: Introductionmentioning

confidence: 99%

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Influence of interparticle interaction on melting of gold nanoparticles in Au/polytetrafluoroethylene nanocomposites

Yeshchenko

Dmitruk

Grytsenko

et al. 2009

Journal of Applied Physics

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The temperature dependence of the surface plasmon resonance energy and width in 5 nm spherical gold nanoparticles embedded in a polymer polytetrafluoroethylene matrix has been studied using absorption spectroscopy. The jumplike features have been observed in these dependences indicating the melting of gold nanoparticles at temperatures considerably lower than the bulk melting point. The interaction between gold nanoparticles sufficiently affects the melting of nanoparticles. The increase in the filling factor of the particles leads to a decrease in the melting temperature of gold nanoparticles.

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Section: -3supporting

confidence: 88%

Section: Introductionmentioning

confidence: 99%

Influence of interparticle interaction on melting of gold nanoparticles in Au/polytetrafluoroethylene nanocomposites

Yeshchenko

Dmitruk

Grytsenko

et al. 2009

Journal of Applied Physics

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“…The surface to volume ratio for the nanocrystals is accounted for by considering the number of atoms at the nanocrystal surface, N, and the total number of atoms in the nanocrystal, n. Thus, at sizes when the surface area to volume ratio is large, the melting point is predicted to be depressed relative to the bulk value. This prediction is consistent with observations that other researchers have made on the melting point of nanoscale systems [6,14,15]. It remains unclear how accurately a model of melting point depression based strictly on the size and shape of the given nanocrystal predicts the materials' melting point.…”

Section: Introductionsupporting

confidence: 80%

Comparison of the observed size-dependent melting point of CdSe nanocrystals to theoretical predictions

et al. 2018

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Cadmium selenide nanocrystals were observed to have a size-dependent melting point which was depressed relative to the bulk melting temperature. The observed size-dependent melting point ranged from 500-1478 K, while a model based on the surface area to volume ratio predicted that is should range between 774-1250 K. The nanocrystals were heated in situ in the electron microscope, and the melting point was almost immediately followed by the vaporization of the CdSe nanocrystals, allowing for straightforward determination of the melting temperature. The differences between the observed melting point of CdSe nanocrystals and the values predicted by the surface area to volume ratio model indicates that additional factors are involved in the melting point depression of nanocrystals.

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“…The Delta H of Sn-3.0Ag-0.5Cu nanoparticles is 5.25 J/g, corresponding well with our previous work on Sn-Ag-Cu nanoparticles. 9) The Delta H of Sn-Ag-Cu nanoparticles is about 10 times smaller than microsized Sn-Ag-Cu solder alloy because of particle-size-dependent of Delta H. This phenomenon can also be found in Sn-Co-Cu nanoparticles, 12) Sn nanoparticles 13) and Sn-Ag nanoparticles. 14) 3.2 Microstructure observation Figure 4 shows the microstructures of the Sn-58Bi solder joint and the composite solder joint.…”

Section: )mentioning

confidence: 66%

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

et al. 2010

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This work looks at the development and investigation of a reinforced composite solder with low melting point. The composite solder was prepared by adding Sn-3.0Ag-0.5Cu nanoparticles into Sn-58Bi solder paste. The Sn-3.0Ag-0.5Cu nanoparticles were manufactured using a self-developed Consumable-electrode Direct Current Arc (CDCA) technique. The test FR-4 Printed Circuit Board (PCB) with Cu pad and Electroless Nickel Immersion Gold (ENIG) surface finish were fabricated, and fifty SR1206 chip resistors were mounted on pads of test PCB with the reinforced composite solder paste by using conventional surface mount technology. The differential scanning calorimetry (DSC) was used to analyze the constituent of the composite solder joint after reflow. A scanning electron microscope (SEM), transmission electron microscope (TEM) and optical microscope (OM) were employed in order to observe the morphology of nanoparticles; the microstructure of reinforced composite solder joint; the crack initiation and propagation in solder joint; and the fracture mode after shear test. The thermal cycling (TC) was carried out with a temperature range of À40 C and 125 C. The contact resistance of the solder joint was measured during thermal cycling, and the shear test of solder joints was performed before and after 500 thermal cycles. After the shear test, all fracture surfaces were inspected to identify the fracture mode of the composite solder joint. The results of the experiments detailed in this work indicate that the shear strength of the composite solder increased 2 times in comparison to Sn-58Bi. Meanwhile, the thermomechanical fatigue (TMF) resistance of the composite solder with 1 mass% nanoparticles was 16 times stronger than Sn-58Bi and 4 times stronger than Sn-3.0Ag-0.5Cu. However, the tendency of forming micro-cracks between nanoparticles and solder matrix and the fracture within solder was increased for solder joints with more than 3 mass% nanoparticles after thermal cycling.

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Size-dependent melting properties of tin nanoparticles

Cited by 192 publications

References 18 publications

Influence of interparticle interaction on melting of gold nanoparticles in Au/polytetrafluoroethylene nanocomposites

Influence of interparticle interaction on melting of gold nanoparticles in Au/polytetrafluoroethylene nanocomposites

Comparison of the observed size-dependent melting point of CdSe nanocrystals to theoretical predictions

A Reliability Study of Nanoparticles Reinforced Composite Lead-Free Solder

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