Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints

Zhou, Min-Bo; Zhao, Xing-Fei; Yue, Wu; Ke, Chang-Bo; Zhang, Xin-Ping

doi:10.1109/icept.2017.8046756

Search citation statements

Order By: Relevance

Paper Sections

Select...

Imc Formation and Growth1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2019

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Due to the higher IMC growth rate at the angle of the wedge than other districts, a salient triangle formed at the angle. Due to the significant solder volume to substrate surface area ratio in micro-bump solder joints, the IMC growth behavior could be controlled by the surface diffusion mechanism [36].…”

Section: Imc Formation and Growthmentioning

confidence: 99%

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

View full text Add to dashboard Cite

With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.

show abstract

Section: Imc Formation and Growthmentioning

confidence: 99%