2010
DOI: 10.1149/1.3375622
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SiO Emission and Incorporation in Silicon Oxidation Process Using Molecular Dynamics Method

Abstract: We investigated the dynamics of oxidation processes with stress relaxation in the Si/SiO2 interface by using variable charge molecular dynamics methods. An SiO molecule is emitted from the Si/SiO2 interface into the SiO2 region in order to release the accumulated stress in the interface. The emitted SiO molecule moves into the SiO2 network having Si dangling bonds. The SiO molecule is completely incorporated into the SiO2 network after an oxygen atom (oxygen vacancy) diffuses to be bonded with these Si danglin… Show more

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Cited by 3 publications
(2 citation statements)
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“…Several mechanisms of releasing the stress have been suggested. Among them, the SiO emission mechanism [1] could make the best explanation for our experimental results. After release the SiO, Si-O bond of the SiO 2 network was broken due to the charge transfer from the diffusing SiO molecule.…”
Section: Resultsmentioning
confidence: 69%
See 1 more Smart Citation
“…Several mechanisms of releasing the stress have been suggested. Among them, the SiO emission mechanism [1] could make the best explanation for our experimental results. After release the SiO, Si-O bond of the SiO 2 network was broken due to the charge transfer from the diffusing SiO molecule.…”
Section: Resultsmentioning
confidence: 69%
“…However, recently new oxidation mechanisms have been reported. As the oxidation proceeds, stress is accumulated in the Si/SiO 2 interface region due to the expansion of the volume per Si atom in the SiO 2 [1]. This stress should be released in order to advantage further oxidation.…”
Section: Resultsmentioning
confidence: 99%