Sintering of Copper Particles for Die Attach

Kahler, J.; Heuck, N.; Wagner, Alexander; Stranz, A.; Peiner, Erwin; Waag, A.

doi:10.1109/tcpmt.2012.2201940

Cited by 67 publications

(21 citation statements)

References 19 publications

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“…However, Ag is expensive and is poorly resistant to migration. Cu nanoparticles have recently been studied as a bonding material instead of Ag nanoparticles, because Cu is inexpensive and less susceptible to electromigration [18]. However, robust bonding joints are hardly ever obtained without applying high pressures, because their oxidized surface layers prevent the Cu nanoparticles from sintering and reacting with the substrates [19,20].…”

mentioning

confidence: 99%

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Qiao

2016

Scripta Materialia

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confidence: 99%

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Qiao

2016

Scripta Materialia

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“…However, high-cost and low compatibility with conventional soldering processes inhibit the industrial use of these materials. Another low-cost bonding method, copper sinter bonding, has been researched, as it provides excellent conductivity, high-temperature durability and high electrical migration resistance [14][15][16]; however, surface coating of Cu particles or reducing the atmosphere for the sintering process was generally required because of its oxidation affinity under storage in air, which inhibits sintering. Thus, inexpensive and highly reliable bonding technologies are being investigated for advanced power modules.…”

Section: Introductionmentioning

confidence: 99%

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

et al. 2019

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We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds (IMCs) partially filled with polyimide resin, is obtained by the pressureless TLPS process at 250 °C for 1 min using a novel Cu-solder-resin composite as the bonding material in a nitrogen atmosphere. Macro- and micro-deformation properties of the unique microstructure of the TLPS Cu-IMC-resin are evaluated by finite element analysis using a three-dimensional image reconstruction model. The macroscopic computational uniaxial tensile tests of the Cu-IMC-resin model reveal that the utilization of the IMCs and the addition of the easily-deformable resin facilitates the temperature-stability and low-stiffness of the mechanical properties. The microstructure exhibits a significantly low homogenized Young’s modulus (11 GPa). Microscopic investigations show that the local stresses are broadly distributed on the IMC regions under uniaxial macroscopic tensile displacement, indicating highly reliable performance of the joint within a specific macroscopic strain condition. Numerical and experimental investigations demonstrate the excellent thermal cyclic reliability of die-attached joints between silicon carbide chips and directly bonded copper substrate.

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“…In case of sintered components required properties is related mainly its porosity, in this case, an inversely proportional relationship. These values include tens (<50 MPa) to a few hundred (<400 MPa) [2][3][4] . Another useful tool for increasing the mechanical strength and wear of copper components can be the introduction of ceramic particles which are homogeneously dispersed.…”

Section: Introductionmentioning

confidence: 99%

Processing of Copper Based Foil Hardened with Zirconia by Non-Deformation Method

et al. 2017

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Flat sintered copper and copper-zirconia substrates, with zirconia nanoparticles contents of 1 and 3 vol%, were produced by aqueous tape casting and controlled sintering. Aqueous suspensions were prepared to a solid content of 58 vol% using 3 wt% commercial binder emulsion. The green tapes were treated at 350 ºC in air to remove organics and sintered at temperatures ranging from 800 to 1000 ºC in atmosphere of Ar/5%H 2 . Copper tapes reached almost full densification at 900 ºC. Composite with 1 vol% zirconia, sintered at 800 ºC, maintained high density and provided a noticeable increase of the mechanical strength, whereas further additions up to 3 vol% reduced the densification and the resulting mechanical performance became poorer.

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Sintering of Copper Particles for Die Attach

Cited by 67 publications

References 19 publications

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

Processing of Copper Based Foil Hardened with Zirconia by Non-Deformation Method

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