Sintering, in different temperatures, of traces of silver printed in flexible surfaces

Mancosu, Rafael Drumond; Quintero, Jairo; Azevedo, R. E. S.

doi:10.1109/esime.2010.5464510

Cited by 9 publications

(7 citation statements)

References 2 publications

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“…The obtained results by this method are in accordance with the ones found in bibliography [9,18]. As an indicative value, a 10% or 20% of the conductivity of the pure silver can be considered.…”

Section: Characterization Of the Conductivity Of The Inksupporting

confidence: 89%

“…In the fabrication process, several parameters are involved, such as, size of ink nanoparticles, substrate, surface tension of the particle and of the substrate, time and temperature of the ink sintering, among others [9], which provide a wide range of degree of freedom for circuit designs, and particularly for antennas, on flexible substrates. Future terminals, such as smartphones, are envisaged to be completely flexible in the near future [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

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Inkjet Printed Planar Coil Antenna Analysis for NFC Technology Applications

Ortego

Sanchez

García

et al. 2012

International Journal of Antennas and Propagation

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The aim of this paper is to examine the potential of inkjet printing technology for the fabrication of Near Field Communication (NFC) coil antennas. As inkjet printing technology enables deposition of a different number of layers, an accurate adjustment of the printed conductive tracks thickness is possible. As a consequence, input resistance andQfactor can be finely tuned as long as skin depth is not surpassed while keeping the same inductance levels. This allows the removal of the typical damping resistance present in current NFC inductors. A general methodology including design, simulation, fabrication, and measurement is presented for rectangular, planar-spiral inductors working at 13.56 MHz. Analytical formulas, computed numerical models, and measured results for antenna input impedance are compared. Reflection coefficient is designated as a figure of merit to analyze the correlation among them, which is found to be below −10 dB. The obtained results demonstrate the suitability of this technology in the fabrication of low cost, environmentally friendly NFC coils on flexible substrates.

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Section: Characterization Of the Conductivity Of The Inksupporting

confidence: 89%

Section: Introductionmentioning

confidence: 99%

Inkjet Printed Planar Coil Antenna Analysis for NFC Technology Applications

Ortego

Sanchez

García

et al. 2012

International Journal of Antennas and Propagation

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“…In order to ensure the correct bonding of the silver particles to the textile substrate and the enhancement of the electro-conductivity of the resulting electro-textile, the ink requires sintering. As literature states, in using a thermal sintering process, the sintering temperature below 100°C will cause the treatment to be incomplete, consequently leading to a reduced conductivity value [24]. The sintered silver ink might have a hairy fuzzy appearance if the silver content is low; however, this can be overcome by raising the sintering temperature to 250°C [25].…”

Section: Introductionmentioning

confidence: 99%

A wearable piezo-resistive sensor for capturing cardiorespiratory signals

Wang¹,

Ali²,

Wijekoon³

et al. 2018

Sensors and Actuators A: Physical

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This paper presents the performance of a new nonwoven piezo-resistive sensor for capturing cardiorespiratory signals. The novel piezo-resistive sensor is fabricated by sandwiching a nano silver electro-conductive ink impregnated nonwoven material between two layers of knitted silver fabric that function as sensor electrodes. The paper describes the technology for minimizing the signal noise due to motion artifacts in the sensor. The nonwoven piezo-resistive sensor is tested on volunteers by capturing their cardiorespiratory signals, where the signal noise is filtered using a bandpass filter. The paper further presents the analysis of the performance of the sensor together with a comparison against a commercially available, portable, cardiorespiratory signal monitoring device. The study shows that the wearable nonwoven piezo-resistive sensor system is highly sensitive, and it is an accurate and reliable sensor for capturing cardiorespiratory signals.

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“…Such a process is often categorically labeled as DW and also encompasses microdispensing methodologies [10] where there has been a large focus on the creation of flexible electronics by way of printing electronic materials on flexible substrates such as polyimide film and paper among others [10][11][12][13][14][15][16]. On its own, the industry of flexible electronics manufacturing is expected to be worth on the order of $300 Â10 9 by the year 2028 [17].…”

Section: Introductionmentioning

confidence: 99%

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Roberson

Wicker

MacDonald

2015

Journal of Electronic Packaging

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Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 C and 42 C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

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Sintering, in different temperatures, of traces of silver printed in flexible surfaces

Cited by 9 publications

References 2 publications

Inkjet Printed Planar Coil Antenna Analysis for NFC Technology Applications

Inkjet Printed Planar Coil Antenna Analysis for NFC Technology Applications

A wearable piezo-resistive sensor for capturing cardiorespiratory signals

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

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