Sintering Characterizations of Ag-Nano Film on Silicon Substrate

Abstract

Nowadays, thin films have many applications in every field. So, in order to improve the performance of thin film devices, it is necessary to characterize their mechanical as well as electrical properties. In this research work we focus on the development of a model for the analysis of the mechanical and electrical properties of silver nanoparticles deposited on silicon substrates. The model consists of inter-particle diffusion modeling and finite element analysis. In this study, through the simulation of the sintering process, it is shown that how the geometry, density, and electrical resistance of the thin film layer are changed with sintering conditions. The model is also used to approximate the values of the film Youngs modulus. Comparing results with experimental results shows the high accuracy of this approach.

Towards in-situ quality control of conductive printable electronics: a review of possible pathways

“…Once all organic components are melted, nanoparticles are arranged tidily in a single layer film as depicted in figure 6(b). Necks begin to grow between contacting nanoparticles, leading to the growth of grains [42]. Figure 6(c) indicates the increase in density from the time the particle became compact.…”