Single‐Photon Nonreciprocity with an Integrated Magneto‐Optical Isolator

Ren, Shang-Yu; Yan, Wei; Feng, Lan-Tian; Chen, Yang; Wu, Yunkun; Qi, Xiao-Zhuo; Xiao-JingLiu,; Cheng, Yuanbing; Xu, Binduo; Deng, Longjiang; Guo, Guang‐Can; Bi, Lei; Ren, Xuemei

doi:10.1002/lpor.202100595

Cited by 12 publications

(5 citation statements)

References 38 publications

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“…On-chip nonreciprocal devices, such as isolators and circulators, play a pivotal role in a wide range of applications for optical communications, all-optical signal processing, spectroscopy, sensing and LiDAR. Currently, non-reciprocity has been demonstrated through the integration of magneto-optical materials [1][2][3][4] and spatiotemporal modulation of the medium [5][6][7][8][9][10]. However, the former approach suffers from sophisticated fabrication techniques and high insertion losses while the latter relies on expensive high-speed signal sources (usually with frequencies exceeding tens of gigahertz ought).…”

Section: Introductionmentioning

confidence: 99%

On-chip all-optical nonreciprocal device for short-pulse isolator based on free carrier dispersion effect

Hong,

Xu,

Xia

et al. 2024

Preprint

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Chip-scale nonreciprocal devices, including isolators and circulators, are indispensable in the application of optical communications, all-optical signal processing and LiDAR, holding the advantages of small-size, mass-production and portability. Approaches that involve the integration of magnetooptical materials and spatiotemporal modulation have been demonstrated, yet with a high insertionloss or requiring additional bias. Here, we proposed a novel all-optical, passive, bias-free nonreciprocal silicon chip based on free carrier dispersion effect for short pulse application scenarios. An asymmetric and scalable silicon resonator is fabricated using a standard CMOS technique with the footprint of only 100 μm2, showing a nonreciprocal transmission ratio of 25 dB, with an insertion loss as low as 1.65 dB under CW laser conditions. A clear blue shift with 0.03 nm is observed under 1 ns pulse with the incident operated peak power ranging from 13 mW to 105 mW. Furthermore, we apply it for chip-based isolator with a high isolation ratio and LiDAR with a spatial resolution down to 15 cm. Such short-pulse suitable nonreciprocal devices can greatly enhance the spatial resolution of LiDAR or increase the on-chip integration density since the reflecting-safe distance is greatly shortened. Therefore, this work provides a building block for high-performance chip-scale LiDAR and high integration density optical processing and communication devices.

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Section: Introductionmentioning

confidence: 99%

On-chip all-optical nonreciprocal device for short-pulse isolator based on free carrier dispersion effect

Hong,

Xu,

Xia

et al. 2024

Preprint

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“…The systems often involve numerous independent building blocks, such as beam splitters (BSs), modulators and delay lines [1,2], which always need a large space and bear mechanical and thermal disturbances [3,4]. Compared to free-space optics and fiber optics, photonic integrated circuits (PICs) are promising platforms to overcome these difficulties due to their small footprint, scalability, programmability, and stability [5][6][7][8][9]. PICs provide opportunities to demonstrate large-scale quantum information processing that contains numerous optical components with millimeter scale, that is, quantum photonic integrated circuits (QPICs) [10,11].…”

Section: Introductionmentioning

confidence: 99%

Photonic-chip-based dense entanglement distribution

et al. 2023

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The dense quantum entanglement distribution is the basis for practical quantum communication, quantum networks and distributed quantum computation. To make entanglement distribution processes stable enough for practical and large-scale applications, it is necessary to perform them with the integrated pattern. Here, we first integrate a dense wavelength-division demultiplexing system and unbalanced Mach-Zehnder interferometers on one large-scale photonic chip and demonstrate the multi-channel wavelength multiplexing entanglement distribution among distributed photonic chips. Specifically, we use one chip as a sender to produce high-performance and wideband quantum photon pairs, which are then sent to two receiver chips through 1-km standard optical fibers. The receiver chip includes a dense wavelength-division demultiplexing system and unbalanced Mach-Zehnder interferometers and realizes multi-wavelength-channel energy-time entanglement generation and analysis. High quantum interference visibilities prove the effectiveness of the multi-chip system. Our work paves the way for practical entanglement-based quantum key distribution and quantum networks.

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“…Therefore, the integrated techniques will lead quantum applications moving out of the laboratory and into large-scale and practical. Multiple optical waveguide materials, such as silica [19][20][21][22], silicon (Si) [23], silicon nitride (SiN) [24][25][26][27], lithium niobate [28][29][30], and techniques, such as lithography [31], laser-writing [32], have been developed. Among those materials, silicon photonics is a good candidate because of its easy preparation, high integration density and excellent optical properties [33].…”

Section: Introductionmentioning

confidence: 99%

Silicon photonic devices for scalable quantum information applications

Feng¹,

Zhang

Wang

et al. 2022

Photon. Res.

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With high integration density and excellent optical properties, silicon photonics is becoming a promising platform for complete integration and large-scale optical quantum information processing. Scalable quantum information applications need photon generation and detection to be integrated on the same chip, and we have seen that various devices on the silicon photonic chip have been developed for this goal. This paper reviews the relevant research results and state-of-the-art technologies on the silicon photonic chip for scalable quantum applications. Despite the shortcomings, the properties of some components have already met the requirements for further expansion. Furthermore, we point out the challenges ahead and future research directions for on-chip scalable quantum information applications.

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Single‐Photon Nonreciprocity with an Integrated Magneto‐Optical Isolator

Cited by 12 publications

References 38 publications

On-chip all-optical nonreciprocal device for short-pulse isolator based on free carrier dispersion effect

On-chip all-optical nonreciprocal device for short-pulse isolator based on free carrier dispersion effect

Photonic-chip-based dense entanglement distribution

Silicon photonic devices for scalable quantum information applications

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