“…In practice, this basic configuration does not really account for the actual structure. In fact, the effects of the finite substrate thickness [ 5 ] , upper and/or back shielding and boxing [6], finite extent ground planes [7,8], or multilayer dielectrics [9,10]-used in MMIC applications-should be incorporated in the analysis. In any case, simple or modified CPWs are attractive due to some interesting features which make them more suitable than microstrip for many applications: easy seriesshunt connections, low crosstalk, low radiation, miniaturization capabilities, and wider impedance range is achievable [l-3,6,8], among others.…”