2018
DOI: 10.1109/tns.2018.2797543
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Single-Event Effects in the Peripheral Circuitry of a Commercial Ferroelectric Random Access Memory

Abstract: This is a self-archived version of an original article. This version may differ from the original in pagination and typographic details.

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Cited by 14 publications
(6 citation statements)
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References 12 publications
(14 reference statements)
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“…The occurrence of SELs on an MRAM (Magnetoresistive Random Access Memory) is presented in [30]. Additionally, radiation-induced SEEs in a COTS FRAM (Ferroelectric Random Access Memory) are described in [31]. Studies on these memories show that SEEs can occur in different ways, such as SBUs, Multiple Cell Upsets (MCUs), SEFIs, or SELs, and it generates different kinds of fault behaviors on the devices.…”
Section: Radiation-induced Effects On Memoriesmentioning
confidence: 99%
“…The occurrence of SELs on an MRAM (Magnetoresistive Random Access Memory) is presented in [30]. Additionally, radiation-induced SEEs in a COTS FRAM (Ferroelectric Random Access Memory) are described in [31]. Studies on these memories show that SEEs can occur in different ways, such as SBUs, Multiple Cell Upsets (MCUs), SEFIs, or SELs, and it generates different kinds of fault behaviors on the devices.…”
Section: Radiation-induced Effects On Memoriesmentioning
confidence: 99%
“…The results indicate that SEUs and SEFIs happened during these tests. Also, the failure modes of a COTS 130-nm FM22L16 FRAM under heavy ions and pulsed focused X-ray beams were executed in [16]. Mixed failure modes were observed in several types involving individual bits, isolated words, groups of pages, 1-bit-wide columns, entire regions of the memory array, and SEFIs.…”
Section: ) Radiation Effects On Framsmentioning
confidence: 99%
“…random-access memory (RRAM), [4][5][6] magnetic random-access memory (MRAM), [7][8][9] and ferroelectric random-access memory (FeRAM), [10,11] which were widely concerned. At present, as one of the candidates for the next-generation non-volatile memory, RRAM had a great advantage in terms of simple structure, which was demonstrated to exhibit excellent miniaturization potential down to <10 nm.…”
Section: Doi: 101002/aelm201900756mentioning
confidence: 99%
“…However, as the feature size scaled down, flash technology was facing the challenge of scalability. Therefore, it was urgent to study the next‐generation of non‐volatile storage technologies for the demand of high capacity storage such as phase change memory (PCM), resistive random‐access memory (RRAM), magnetic random‐access memory (MRAM), and ferroelectric random‐access memory (FeRAM), which were widely concerned. At present, as one of the candidates for the next‐generation non‐volatile memory, RRAM had a great advantage in terms of simple structure, which was demonstrated to exhibit excellent miniaturization potential down to <10 nm.…”
Section: Introductionmentioning
confidence: 99%