2019
DOI: 10.1515/aot-2019-0016
|View full text |Cite
|
Sign up to set email alerts
|

Single-digit 6-nm multilevel patterns by electron beam grayscale lithography

Abstract: We report on the fabrication of very high-resolution discrete four-resist-level grayscale patterns in poly(methyl methacrylate) with just 6-nm step height and down to 32-nm step width using dose-modulated, grayscale electron beam lithography and a low-contrast resist-developer system. This direct pattern writing is important for replication in high-volume manufacturing of diffractive optics. An innovative concept of unexposed auxiliary spacers helped to enhance the discrete character of the multi-level pattern… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
10
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
7

Relationship

3
4

Authors

Journals

citations
Cited by 10 publications
(10 citation statements)
references
References 28 publications
0
10
0
Order By: Relevance
“…In this case too, the electrons in contact with the resist are modifying its solubility, permitting the selective removal of the exposed or non-exposed regions of the resist by subsequent etching in a solvent. The main advantage of this method relies on the maskless fabrication of sub-20 nm patterns in the horizontal plane [ 63 ] and of sub-10 nm patterns in the vertical plane [ 64 ] by employing a computer software that guides a finely focused beam of electrons over the patternable surface. Nonetheless, the best contrast and sensitivity of the material has to be considered when choosing the appropriate resist for high-aspect ratio patterns [ 65 ] and when aiming at sub-20 nm resolution on both positive and negative tones resists [ 66 ].…”
Section: Top–down Lithographic Methodologiesmentioning
confidence: 99%
“…In this case too, the electrons in contact with the resist are modifying its solubility, permitting the selective removal of the exposed or non-exposed regions of the resist by subsequent etching in a solvent. The main advantage of this method relies on the maskless fabrication of sub-20 nm patterns in the horizontal plane [ 63 ] and of sub-10 nm patterns in the vertical plane [ 64 ] by employing a computer software that guides a finely focused beam of electrons over the patternable surface. Nonetheless, the best contrast and sensitivity of the material has to be considered when choosing the appropriate resist for high-aspect ratio patterns [ 65 ] and when aiming at sub-20 nm resolution on both positive and negative tones resists [ 66 ].…”
Section: Top–down Lithographic Methodologiesmentioning
confidence: 99%
“…To achieve comparable patterns, high‐resolution grayscale lithography along with sophisticated pattern transfer would be required. [ 18–20,21 ]…”
Section: Figurementioning
confidence: 99%
“…To achieve comparable patterns, high-resolution grayscale lithography along with sophisticated pattern transfer would be required. [18][19][20]21] Of course, different shapes of initial patterns are conceivable but this work concentrates on rectilinear shapes ( Figure S1, Supporting Information) to obtain pyramidal structures with rectilinear base. The respective metal patterns are obtained via lift-off processing of electron beam evaporated thin gold, platinum, or chromium films with and without titanium adhesion layers.…”
mentioning
confidence: 99%
“…Usually, a lower contrast is more suitable for GEBL due to higher resilience against dose variations [12]. However, high-resolution patterns [13] demanded minimal dark erosion for the unexposed patterns, especially in this relative low M w resist, and thus, required IPA to be used as co-solvent.…”
Section: Pattern Origination With Geblmentioning
confidence: 99%
“…3). For laterally high-resolution steps, a quasi-continuous pattern might be obtained due to the non-negligible lateral development and thus an effective merging of neighboring steps [13]. Due to the variation of the GEBL dose, the M w, and thus, the T g varies significantly [10].…”
Section: Pattern Origination With Geblmentioning
confidence: 99%