Single-Chip Beam Scanner with Integrated Light Source for Real-Time Light Detection and Ranging

Lee, Jisan; Shin, Dongjae; Jang, Byung Koog; Byun, Hyunil; Lee, Changbum; Shin, Changyong; Hwang, Inoh; Shim, Dongshik; Lee, Eunkyung; Kim, Jinmyung; Son, Kyunghyun; Otsuka, Tatsuhiro; Ha, K. H.; Choo, Hyuck

doi:10.1109/iedm13553.2020.9371987

Cited by 8 publications

(12 citation statements)

References 11 publications

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“…In the POC2, it became III/V-on-Si, and the SOAs were on-chip [49]. In POC3, the SOAs and TLD were on-chip [50]. The POC4 having everything on-chip is under development.…”

Section: Lidar Progressmentioning

confidence: 99%

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Bulk-Si Platform: Born for DRAM, Upgraded With On-Chip Lasers, and Transplanted to LiDAR

Shin

Byun

Shim

et al. 2022

J. Lightwave Technol.

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The CMOS industry has been expecting silicon photonics to provide photonic and electro-photonic integrated circuits based on the CMOS processes and infrastructures for scalability of incumbent technology evolutions and creation of novel technologies. However, the compatibility with the legacy CMOS has been compromised with the development convenience of early silicon photonics in that the specialty silicon-on-insulator substrates have been widely used as integration platforms. Since this specialty substrate may hinder the photonics integration with legacy volume products later, a legacy-friendly integration platform with a generic bulk-silicon substrate has been developed for better compatibility. This paper overviews the bulk-silicon photonics platform born for DRAM integration, upgraded with III/V-on-bulk-Si lasers, and transplanted to LiDAR applications requiring the virtuous cycle of cost and volume. The photonics integration with DRAM was to resolve the speed-capacity tradeoff in the DRAM interconnects, and technical feasibility as well as lessons learned from the integration attempt are reviewed. The bulk-silicon device performance approaches that of silicon-oninsulator devices with the thermal advantage of ~40-% lower thermal impedance and the optical disadvantage of ~0.4-dB/mm higher waveguide loss. In the LiDAR applications, detection performance up to ~20 m at 20 fps by a single-chip scanner integrating tunable laser, semiconductor optical amplifiers, and optical phased array are presented with future outlooks.

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“…In the POC2, it became III/V-on-Si, and the SOAs were on-chip [49]. In POC3, the SOAs and TLD were on-chip [50]. The POC4 having everything on-chip is under development.…”

Section: Lidar Progressmentioning

confidence: 99%

“…16(b), but the module progress will be expedited after the LiDAR chip settles down. In the module POC1, it was a set-up rather than a module [48]- [50]. In the module POC2, it became the module in a table-top size [51].…”

Section: Lidar Progressmentioning

confidence: 99%

Bulk-Si Platform: Born for DRAM, Upgraded With On-Chip Lasers, and Transplanted to LiDAR

Shin

Byun

Shim

et al. 2022

J. Lightwave Technol.

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“…Our previous work [9] showed the LIDAR demonstration up to 10 meters with in-lab optical setup. In this work, we designed a compact solid-state LIDAR module and improved the ranging performance up to 20 meters with improved device setup, digital signal processing, and image processing.…”

Section: Discussionmentioning

confidence: 99%

Real-time LIDAR imaging by solid-state single chip beam scanner

Jisan¹,

Kyunghyun²,

Changbum³

et al. 2022

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We present a real-time light detection and ranging (LIDAR) imaging by developing a single-chip solid-state beam scanner. The beam scanner is integrated with a fully functional 32-channel optical phased array, 36 optical amplifiers, and a tunable laser at central wavelength ~1310 nm, all on a 7.5 󠇎× 3 mm 2 single chip fabricated with III-V on silicon processes. The phased array is calibrated with self-evolving genetic algorithm to enable beam forming and steering in two dimensions. Distance measurement is performed with a digital signal processing that measures the time of flight (TOF) of pulsed light with a system consisting of an avalanche photodiode (APD), trans-impedance amplifier (TIA), analog-digital converter (ADC), and a processor. The LIDAR module utilizing this system can acquire point cloud images with 120 × 20 resolution with a speed of 20 frames per seconds at a distance up to 20 meters. This work presents the first demonstration of a chip-scale LIDAR solution without any moving part or bulk external light source or amplifier, making an ultralow cost and compact LIDAR technology a reality.

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“…In 2020, the study by Lee et al. [ 14 ] demonstrated the first chip‐scale LiDAR solution with integrated optical source and amplifier, which paves way for low‐cost, compact fully integrated solid‐state LiDAR sensor. The schematic of the chip‐scale device based on III–V‐on‐Si is illustrated in Figure a, where the inset shows the microscopy image of the fabricated chip with a size of 7.5 mm × 3 mm.…”

Section: Conventional Solid‐state Lidar Sensormentioning

confidence: 99%

“…Traditional LiDAR sensors make use of a mechanical rotation mechanism to achieve wide field‐of‐view (FOV) scanning, which places limitations on reliability, size, and cost. [ 14 ] These limitations can be overcome by using a solid‐state approach.…”

Section: Introductionmentioning

confidence: 99%

A Progress Review on Solid‐State LiDAR and Nanophotonics‐Based LiDAR Sensors

Xue

et al. 2022

Laser & Photonics Reviews

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Light detection and ranging (LiDAR) sensors enable precision sensing of an object in 3D. LiDAR technology is widely used in metrology, environment monitoring, archaeology, and robotics. It also shows high potential to be applied in autonomous driving. In traditional LiDAR sensors, mechanical rotator is used for optical beam scanning, which brings about limitations on their reliability, size, and cost. These limitations can be overcome by a more compact solid‐state solution. Solid‐state LiDAR sensors are commonly categorized into the following three types: flash‐based LiDAR, microelectromechanical system (MEMS)‐based LiDAR, and optical phased array (OPA)‐based LiDAR. Furthermore, advanced optics technology enables novel nanophotonics‐based devices with high potential and superior advantages to be utilized in a LiDAR sensor. In this review, LiDAR sensor principles are introduced, including three commonly used sensing schemes: pulsed time of flight (TOF), amplitude‐modulated continuous wave TOF, and frequency‐modulated continuous wave. Recent advances in conventional solid‐state LiDAR sensors are summarized and presented, including flash‐based LiDAR, MEMS‐based LiDAR, and OPA‐based LiDAR. The recent progress on emerging nanophotonics‐based LiDAR sensors is also covered. A summary is made and the future outlook on advanced LiDAR sensors is provided.

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Single-Chip Beam Scanner with Integrated Light Source for Real-Time Light Detection and Ranging

Cited by 8 publications

References 11 publications

Bulk-Si Platform: Born for DRAM, Upgraded With On-Chip Lasers, and Transplanted to LiDAR

Bulk-Si Platform: Born for DRAM, Upgraded With On-Chip Lasers, and Transplanted to LiDAR

Real-time LIDAR imaging by solid-state single chip beam scanner

A Progress Review on Solid‐State LiDAR and Nanophotonics‐Based LiDAR Sensors

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