2005
DOI: 10.1063/1.1925762
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Single beam determination of porosity and etch rate in situ during etching of porous silicon

Abstract: A laser reflection method has been developed and tested for analyzing the etching of porous silicon (PS) films. It allows in situ measurement and analysis of the time dependency of the etch rate, the thickness, the average porosity, the porosity profile, and the interface roughness. The interaction of an infrared laser beam with a layered system consisting of a PS layer and a substrate during etching results in interferences in the reflected beam which is analyzed by the short-time Fourier transform. This meth… Show more

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Cited by 29 publications
(24 citation statements)
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“…One of these studies was reported by Foss et al 1 They used an interferometric method by using an infrared laser to illuminate the Si in the side that was not in contact with the electrolyte, producing interference between the beams reflected in the PS/electrolyte, PS/Si, and Si/air interfaces. The obtained signal was analyzed using short-time Fourier transform (STFT), and it was possible to determine PS parameters such as porosity, thickness, etching rate, and interface roughness.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…One of these studies was reported by Foss et al 1 They used an interferometric method by using an infrared laser to illuminate the Si in the side that was not in contact with the electrolyte, producing interference between the beams reflected in the PS/electrolyte, PS/Si, and Si/air interfaces. The obtained signal was analyzed using short-time Fourier transform (STFT), and it was possible to determine PS parameters such as porosity, thickness, etching rate, and interface roughness.…”
Section: Introductionmentioning
confidence: 99%
“…Profilometry has been used to determine interface roughness, and gravimetry to determine the porosity. 1 These techniques are contact, destructive, and are not able to give information about physic properties at the same time that the PS is forming.…”
Section: Introductionmentioning
confidence: 99%
“…It was found that the etching velocity as well as the porosity have time dependence. On the other hand, Foss et al 8 used the same methodology to determine the porosity, the thickness, and the roughness of the PS film thru a back detection.…”
Section: Introductionmentioning
confidence: 99%
“…This means, that during the PSi formation, it is possible to follow the changes in the thickness, roughness, and porosity by using light interferometry because the optical path changes continuously and multiple interfaces where the light can be reflected appear. This methodology and the mathematical model were reported in [12][13][14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…The main techniques reported to study the in situ formation of PSi by electrochemical etching in hydrofluoric acid(HF) media are: in situ Fourier transform infrared spectrometry (FTIR) [10,11], optical interferometry [12][13][14][15][16][17] optical scattering [19,20], and photoacoustics [21][22][23][24][25].…”
Section: Introductionmentioning
confidence: 99%