Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling

Vaidyanath, Arun; Thoroddsen, B.; Prince, J.L.; Cangellaris, A.C.

doi:10.1109/96.404109

Cited by 29 publications

(5 citation statements)

References 5 publications

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“…At high frequencies ( Hz), the floating plane's current flows in a direction opposite that of the ground conductor in the coplanar case but in the same direction in the multilayer case. Conductor coupling with currents flowing in opposite directions has been shown to reduce inductance [2].…”

Section: Discussionmentioning

confidence: 99%

“…The inductance matrices obtained from UAEPIC use ground planes with a finite and relatively narrow width when compared to the actual ground planes that the model is supposed to represent. The reason for the truncated ground plane is the need to adequately discretize the planes to capture the current crowding close to the signal trace [2]. At the same time, the plane must be wide enough to accurately capture the majority (>90%) of the current under the signal trace.…”

Section: Modelingmentioning

confidence: 99%

“…The minus sign is due to the currents flowing in opposite directions on the signal trace and the ground plane. From reference [2], the switching noise can be described by (2) Equation (2) illustrates that the mutual coupling between the trace and the ground plane acts to reduce the switching noise.…”

Section: Introductionmentioning

confidence: 99%

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Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

López

Prince

Cangellaris

1999

IEEE Trans. Adv. Packag.

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The impact of a floating metal layer on the effective ground plane inductance has been investigated in both multilayer (ground planes) and coplanar (ground conductors) packages. For the multilayer case, both thick and thin film geometries were examined, and the results were compared to a thin film coplanar configuration. It was seen that the floating plane actually increases the ground plane inductance in the multilayer case and decreases the ground plane inductance in the lead frame case. Examining the current density in the floating and ground plane and the ground's partial self-inductance and ground-signal partial mutual inductance give a detailed explanation for this phenomenon.Index Terms-Coplanar transmission line, eddy currents, floating metal, package inductance, stripline transmission line.

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Section: Discussionmentioning

confidence: 99%

Section: Modelingmentioning

confidence: 99%

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Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

López

Prince

Cangellaris

1999

IEEE Trans. Adv. Packag.

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“…They presented results showing the dependence between the noise amplitude and the number of switching I/Os, ground connection pins, and channel length. Vaidyanath et al [25], [26] reused the same formulations to study the influence of driver loads and interactions between power planes and signal traces within a package on the SSN. These works highlighted the key role of the power distribution network in understanding and estimating noise propagation.…”

Section: B Research Work Related To Parasitic Emissions Ofmentioning

confidence: 99%

The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future

Ramdani

Sicard

Boyer

et al. 2009

IEEE Trans. Electromagn. Compat.

272

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Throughout the decades of continuous advances in semiconductor technology, from the discrete devices of the late 1950s to today's billon-transistor system-on-chip, there have always been concerns about the ability of components to operate safely in an increasingly disruptive electromagnetic environment. This paper provides a nonexhaustive review of the research work conducted in the field of electromagnetic compatibility (EMC) at the IC level over the past 40 years. It also brings together a collection of information and trends in IC technology, in order to build a tentative roadmap for the EMC of ICs until the year 2020, with a focus on measurement methods and modeling approaches.

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“…The time history of the currents and on the thin-wires at ports 1 and 2, and the voltage drop across the resistor at Port 3 were simulated and recorded. The transfer impedances and were obtained from FDTD using definitions (4) and (5), respectively. The dash-dotted curves in Fig.…”

mentioning

confidence: 99%

Coupling between differential signals and the dc power-bus in multilayer PCBs

Wang

Leone²,

Drewniak³

et al. 2005

IEEE Trans. Adv. Packag.

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Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.

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Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling

Cited by 29 publications

References 5 publications

Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages

The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future

Coupling between differential signals and the dc power-bus in multilayer PCBs

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