Simultaneous improvement of electrical conductivity and mechanical property of Cr doped Cu/CNTs composites

Zuo, Tingting; Li, Jian; Gao, Zhenyu; Wu, Yue; Zhang, Ling; Da, Bo; Zhao, Xingke; Xiao, Liye

doi:10.1016/j.mtcomm.2020.100907

Cited by 16 publications

(9 citation statements)

References 23 publications

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“…The higher the structural integrity graphene has, the better excellent electrical conductivity graphene can retain, which causes a smaller impact on the electrical conductivity of the composite. The higher bonding strength of the graphene/copper interface has the better wettability of the graphene/copper interface, which reduces the scattering of electrons from the interface [ 29 ]. Therefore, there are two main reasons for the small decrease in conductivity.…”

Section: Resultsmentioning

confidence: 99%

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Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

et al. 2022

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To improve the graphene/copper interfacial bonding and the strength of the copper matrix, Cu–Cr–Mg alloy powder and graphene nanosheets (GNPs) have been used as raw materials in the preparation of a layered graphene/Cu–Cr–Mg composite through high-energy ball-milling and fast hot-pressing sintering. The microstructure of the composite after sintering, as well as the effect of graphene on the mechanical properties and conductivity of the composite, are also studied. The results show that the tensile strength of the composite material reached a value of 349 MPa, which is 46% higher than that of the copper matrix, and the reinforcement efficiency of graphene is as large as 136. Furthermore, the electrical conductivity of the composite material was 81.6% IACS, which is only 0.90% IACS lower than that of the copper matrix. The Cr and Mg elements are found to diffuse to the interface of the graphene/copper composite during sintering, and finely dispersed chromium carbide particles are found to significantly improve the interfacial bonding strength of the composite. Thus, graphene could effectively improve the mechanical properties of the composite while maintaining a high electrical conductivity.

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Section: Resultsmentioning

confidence: 99%

“…On the other hand, it benefits from the nanocarbide particles that are formed at the interface of the graphene/copper composite. The wettability between graphene and copper is improved, which greatly reduces the interfacial resistance of the graphene/copper and decreases the range of conductivity [ 6 , 25 , 29 , 30 ].…”

Section: Resultsmentioning

confidence: 99%

Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

et al. 2022

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“…However, problems of poor wettability and interfacial compatibility exist between CNTs and Cu; these problems are believed to be other key factors limiting the performance of CNTs/Cu composites [ 19 , 20 ]. As reported, the addition of carbide-forming elements such as Ti, Cr, and Ni helps form chemical bonds between CNTs and copper, allowing the load to be transferred from the metal matrix to the reinforcements more effectively, and thereby improving the mechanical properties of the composites [ 21 , 22 , 23 , 24 ]. In this study, nickel nanoparticles were uniformly modified on the surface of CNTs by an ultrasonic-assisted electroless nickel plating process (abbreviated as Ni-CNTs).…”

Section: Introductionmentioning

confidence: 99%

Interfacial Bonding Improvement through Nickel Decoration on Carbon Nanotubes in Carbon Nanotubes/Cu Composite Foams Reinforced Copper Matrix Composites

et al. 2022

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Inhomogeneous structures with carbon nanotubes (CNTs), reinforced with Cu composite foams as the reinforcing skeletons (CNTs/Cuf®Cu), have been designed to overcome the paradox between strength and ductility or conductivity in copper matrix composites. The interface between CNTs and the copper matrix is usually weak, due to poor wettability and interaction. In this study, nickel nanoparticles are decorated onto CNTs to improve interfacial bonding. The broader interface transition area between CNTs and copper with Ni3C interfacial products formed, and a combination of improved electrical conductivity (95.6% IACS), tensile strength (364.9 MPa), and elongation (40.6%) was achieved for the Ni-decorated CNTs/Cuf®Cu (Ni-CNTs/Cuf®Cu). In addition, the strengthening mechanisms are discussed in this study.

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“…The third challenge is interface-related. As the bond between the matrix and CNTs, the interface has the charge of transferring load, current and heat, and blocking crack extension [29]. However, the wettability of CNTs with respect to the Cu matrix is weak (wettability angle: 145 • ) [13], and no chemical reaction occurs between CNTs and Cu, resulting in weak bonding between CNTs and the Cu matrix.…”

Section: Introductionmentioning

confidence: 99%

Mechanical and Conductive Properties of Cu Matrix Composites Reinforced by Oriented Carbon Nanotubes with Different Coatings

et al. 2022

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Because of the dilemma that the current industrial Cu enhancement methods lead to a significant decline in conductivity and ductility, Cu matrix composites reinforced by oriented multi-walled carbon nanotubes (MWCNTs) were prepared through sintering, hot extrusion, and cold drawing. Before sintering, Ni, Cu, and Ni&Cu coatings were electroless plated on MWCNTs as the intermediate transition layer, and then they were mixed with Cu powder through a nitrogen bubbling assisted ultrasonic process. By analyzing the composition, microstructure, and formation mechanism of the interface between MWCNTs and the matrix, the influence and mechanism of the interface on the mechanical properties, conductivity, and ductility of the composites were explored. The results indicated that MWCNTs maintained a highly dispersed and highly consistent orientation in the Cu matrix. The coating on Ni@CNT was the densest, continuous, and complete. The Ni@CNTs/Cu composite had the greatest effect, while the Cu composite reinforced by MWCNT without coating had the smallest reduction in elongation and conductivity. The comprehensive performance of the Cu@CNTs/Cu composite was the most balanced, with an ultimate tensile strength that reached 373 MPa, while the ductility and conductivity were not excessively reduced. The axial electrical and thermal conductivity were 79.9 IACS % (International Annealed Copper Standard) and 376 W/mK, respectively.

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Simultaneous improvement of electrical conductivity and mechanical property of Cr doped Cu/CNTs composites

Cited by 16 publications

References 23 publications

Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

Microstructure and Properties of a Graphene Reinforced Cu–Cr–Mg Composite

Interfacial Bonding Improvement through Nickel Decoration on Carbon Nanotubes in Carbon Nanotubes/Cu Composite Foams Reinforced Copper Matrix Composites

Mechanical and Conductive Properties of Cu Matrix Composites Reinforced by Oriented Carbon Nanotubes with Different Coatings

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