Simulations and modeling of planar amperometric oxygen sensors

Ren, Jin; Zhang, Honghai; Liu, Sheng; Wang, Jingdao

doi:10.1016/j.snb.2006.08.003

Cited by 22 publications

(7 citation statements)

References 6 publications

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“…Poisson's ratio (−) Pt (10) 21500 171 0.39 SRO (11) 6500 190 0.3 SiN (12) 3100 285 0.2 Polyimide (13) 1420 2.6 0.34 Table 2 Material properties for FEM analysis (2). in air.…”

Section: Methodsmentioning

confidence: 99%

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

2015

Sensors and Materials

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To improve the transmitting and receiving characteristics of piezoelectric micromachined ultrasonic transducers (pMUTs), the thickness of the diaphragm material SiN x of the pMUT was investigated by vibration analysis using the finite element method (FEM). The vibration magnitudes increase 1.7-fold by changing the SiN x thickness from 1.0 to 0.5 μm as determined by the FEM results. A pMUT with a new structure that has a 0.5-μm-thick SiN x layer was fabricated and evaluated. The vibration of the pMUT was evaluated by a laser Doppler vibrometer (LDV), and the vibration magnitude of the fabricated pMUT was threefold that of our previously reported pMUT. Ultrasonic characteristics such as transmitted ultrasonic sound pressure and ultrasonic sensitivity are also evaluated and compared with those of the previous pMUT. The fabricated pMUT shows 11 times larger transmitted ultrasonic sound pressure and 5 times larger ultrasonic sensitivity than those exhibited by the previous pMUT.

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“…Poisson's ratio (−) Pt (10) 21500 171 0.39 SRO (11) 6500 190 0.3 SiN (12) 3100 285 0.2 Polyimide (13) 1420 2.6 0.34 Table 2 Material properties for FEM analysis (2). in air.…”

Section: Methodsmentioning

confidence: 99%

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

2015

Sensors and Materials

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“…As a result, the limiting current signal and oxygen levels are then found to have a nonlinear relationship, especially for high oxygen concentrations . Slower oxygen ion transport in materials that exhibit mixed oxide and electron conductivity results in a direct correlation between the limiting current and oxygen content. , The use of materials that combine oxide ion or electron properties as a barrier to diffusion has been widely employed for oxygen sensors. − The issue of porosity in a diffused barrier may be resolved by using the hybrid electron–ion conductive solid substances as a barrier to diffusion since they have specific oxygen diffusion characteristics.…”

Section: Introductionmentioning

confidence: 99%

Ti-Doped AgNbO₃ as Novel Dense Diffusion Barriers of Limiting Current Oxygen Sensors

Shan,

Dastan,

Zhang

et al. 2024

Langmuir

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The oxygen sensors with limiting current derived from a dense diffusion barrier have an excellent advantage of detecting oxygen partial pressure by controlling the ratio of air and fuel in combustion environments. Therefore, AgNb 1−x Ti x O 3−δ (wherein x varies from 0.1 to 0.3) was prepared as such a dense diffusion barrier layer for sensor application. Among the investigated compositions as a new condensed barrier for the diffusion of sensors, AgNb 1−x Ti x O 3−δ (x = 0.1, 0.2, 0.3) exhibits oxygen ionic conductivities from 1.37 × 10 −4 to 5.78 × 10 −3 S•cm −1 in the temperature range of 600−900 °C and outstanding stable electrochemical properties. Herein, we employ these novel materials as dense diffusion barriers and 8 mol % zirconia stabilized by yttria (8YSZ) as a solid-state electrolyte for the fabrication of the oxygen sensors with limiting current. We observed a direct connection between the limiting current and oxygen content within the interval of 0.5−5.0 mol % at 800 °C and a low working voltage. The increase of Ti-doping amount in AgNbO 3 accelerates the sensing response to oxygen gas and promotes the service life of the sensor.

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“…Krause et al [ 13 ] evaluated the stress behavior of pressure sensors under mechanical shock. Ren et al [ 14 ] developed a simulation model to predict the temperature distribution and the associated thermal stresses of an amperometric oxygen sensor during the warm-up stage and performed transient heat transfer analysis and thermal stress analysis. Zhang et al [ 15 ] investigated thick film resistors (TFRs, R8241, Heraeus) on 430 stainless steel (SS) substrates for strain sensor applications.…”

Section: Introductionmentioning

confidence: 99%

Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

Sun,

Ma,

Song

et al. 2023

Micromachines

Self Cite

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There is an increasing demand for the use of automotive sensors where complex working environments may easily lead to failure. Wire pull and shear test models based on finite-element analysis are established to evaluate their reliability by investigating the failure mode and mechanism of gold wire bonding. The effect of shear force position and pull force position on failure is also analyzed. The bonding failure was verified by experiments, which is consistent with the simulation result. The results show that: (1) The three-dimensional quantitative modeling reveals the process of bonding delamination and stress concentration. (2) The bonding–slip method (BSM) is adopted in the gold ball detaching process. The concept of three states, including deformation accumulation, cracking, and disengagement, was put forward to reveal the interface stress evolution trend according to the shear testing results. The results indicate that in the interface, the stress in the deformation accumulation state decreases from the tensile side (or compression side) to the center, and the stress in the cracking and disengagement states reduces gradually from the tensile side to the edge. When the interface is completely separated, the failed shear force concentrates on 42 g. The concept and theory proposed in this work can effectively reveal the failure mechanism of bonding interface and help to establish a new failure criterion.

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Simulations and modeling of planar amperometric oxygen sensors

Cited by 22 publications

References 6 publications

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

Ti-Doped AgNbO₃ as Novel Dense Diffusion Barriers of Limiting Current Oxygen Sensors

Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

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Simulations and modeling of planar amperometric oxygen sensors

Cited by 22 publications

References 6 publications

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

Vibration Analysis and Evaluation of Piezoelectric Micromachined Ultrasonic Transducers Using Epitaxial Pb(Zr, Ti)O3 Thin Film

Ti-Doped AgNbO3 as Novel Dense Diffusion Barriers of Limiting Current Oxygen Sensors

Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

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Ti-Doped AgNbO₃ as Novel Dense Diffusion Barriers of Limiting Current Oxygen Sensors