Simulation techniques for EMC compliant design of automotive IC chips and modules

Tsukioka, Akihiro; Nagata, Makoto; Taniguchi, Kohki; Fujimoto, Daisuke; Akimoto, Rieko; Egami, Takao; Niinomi, Kenji; Yuhara, Takeshi; Hayashi, S.; Mathews, Rob; Srinivasan, Karthik K.; Li, Ying-Shiun; Chang, Norman

doi:10.1109/emceurope.2017.8094691

Cited by 13 publications

(2 citation statements)

References 4 publications

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“…Although temporary failures are recovered by turning the power back on, this remains problematic for reliability in the applications such as automotive and medical healthcare which rely on real-time performance (Figure 1). Generally, IC chips are verified to have a certain level of immunity to external disturbances such as electromagnetic field irradiation and conductive radio frequency (RF) power injection following to semiconductor electromagnetic compatibility (EMC) test standards [1]- [3]. The magnitude and frequency of RF disturbances are investigated to determine the threshold at which an IC chip may malfunction, and to verify compliance with EMC regulations that are set forth in the respective field of application.…”

Section: Introductionmentioning

confidence: 99%

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging

Wadatsumi

Kawai

Hasegawa

et al. 2023

IEICE Trans. Electron.

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This paper presents on-chip characterization of electrostatic discharge (ESD) impacts applied on the Si-substrate backside of a flip-chip mounted integrated circuit (FC-IC) chip. An FC-IC chip has an open backside and there is a threat of reliability problems and malfunctions caused by the backside ESD. We prepared a test FC-IC chip and measured Si-substrate voltage fluctuations on its frontside by an on-chip monitor (OCM) circuit. The voltage surges as large as 200 mV were observed on the frontside when a 200-V ESD gun was irradiated through a 5 kΩ contact resistor on the backside of a 350 µm thick Si substrate. The distribution of voltage heights was experimentally measured at 20 on-chip locations among thinned Si substrates up to 40 µm, and also explained in full-system level simulation of backside ESD impacts with the equivalent models of ESD-gun operation and FC-IC chip assembly.

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Section: Introductionmentioning

confidence: 99%

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging

Wadatsumi

Kawai

Hasegawa

et al. 2023

IEICE Trans. Electron.

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“…Electromagnetic compatibility (EMC) can be categorized in two directions: electromagnetic emission, which can disrupt the working of other systems and electromagnetic susceptibility, which basically describes how efficiently our system will work if it is subjected to disturbances from other systems [5]. The circuit's performance may be harmed or possibly shut down because of the disruption.…”

mentioning

confidence: 99%

A review on techniques and modelling methodologies used for checking electromagnetic interference in integrated circuits

Baba

Mustapha²,

Hasbullah³

2022

IJEECS

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The proper function of the integrated circuit (IC) in an inhibiting electromagnetic environment has always been a serious concern throughout the decades of revolution in the world of electronics, from disjunct devices to today’s integrated circuit technology, where billions of transistors are combined on a single chip. The automotive industry and smart vehicles in particular, are confronting design issues such as being prone to electromagnetic interference (EMI). Electronic control devices calculate incorrect outputs because of EMI and sensors give misleading values which can prove fatal in case of automotives. In this paper, the authors have non exhaustively tried to review research work concerned with the investigation of EMI in ICs and prediction of this EMI using various modelling methodologies and measurement setups.

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Machine learning based generic violation waiver system with application on electromigration sign-off

Chang¹,

Baranwal²,

Zhuang³

et al. 2018

2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)

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Simulation techniques for EMC compliant design of automotive IC chips and modules

Cited by 13 publications

References 4 publications

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging

A review on techniques and modelling methodologies used for checking electromagnetic interference in integrated circuits

Machine learning based generic violation waiver system with application on electromigration sign-off

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