Abstract:After Au80/Sn20 eutectic soldering GaAs chips process, Au80/Sn20 solder joints will have large residual stress and strain because of materials' coefficient of thermal expansion (CTE) mismatch. Large strain deformation will lead to the chip position migration. On the other hand too much stress can make the interface micro cracks and affect the quality and long-term reliability of Au80/Sn20 solder joints. Choosing welding pressure, cooling rate and the thickness of the precast solder pieces as the key process pa… Show more
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