Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process

Esfandyari, Alireza; Bachy, Bassim; Raithel, Stefan; Syed-Khaja, Aarief; Franke, Jöerg

doi:10.1016/j.procir.2016.06.092

Cited by 15 publications

(5 citation statements)

References 8 publications

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“…( 9) and (10). Since the specific heat capacity of waste PCBs is 0.6 J g − 1 K − 1 [37], the mass of waste PCBs can be approximately 1476 and 1225 g according to the correlations of input energy versus temperature change and microwave power level versus heating rate, respectively. Furthermore, the coefficient of determination (R 2 ) of microwave power level versus heating rate correlation is higher than that of input energy versus temperature change correlation, so the mass of 1225 g should be more reliable to be regarded as the maximum processing capacity of microwave pyrolysis of waste PCBs.…”

Section: Economic Assessmentmentioning

confidence: 99%

Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods

Huang

Chou

2022

Sustain Environ Res

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Recycling of waste printed circuit boards (PCBs) has attracted increasing attention because of its high annually produced amount and high content of gold. In this study, gold recovery from waste PCBs was carried out by using the processes including microwave pyrolysis, acid leaching, solvent extraction and oxidative precipitation. The leaching efficiency of copper was approximately 95% when using a lixiviant composed of sulfuric acid and hydrogen peroxide, and the leaching efficiencies of gold were approximately 59, 95 and 95% by using thiourea, thiosulfate and aqua regia, respectively. The gold ions contained in the leachate previously produced by the leaching processes were not satisfactorily extracted by using organic solvents including di-(2-ethylhexyl)phosphoric acid, tributyl phosphate, dibutyl carbitol and trioctylamine, so the leachate was decided to bypass solvent extraction and directly apply to the oxidative precipitation process. By using the oxidants of hydrogen peroxide and perchloric acid, the precipitation efficiencies of gold were approximately 95 and 99%, and the final recovery rates were approximately 90 and 93%, respectively. The high recovery rates of gold can be attributable to the use of microwave pyrolysis that prevents the loss of gold caused by shredding and grinding processes. In addition, perchloric acid can provide higher selectivity for gold recovery than hydrogen peroxide. The maximum processing capacity of microwave pyrolysis of waste PCBs would be approximately 1.23 kg. The gold recovered from 1 t of waste PCBs can be sold for approximately USD 10,000, and thus the return on investment can be as high as approximately 1400%.

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Section: Economic Assessmentmentioning

confidence: 99%

Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods

Huang

Chou

2022

Sustain Environ Res

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“…In recent years, there have been numerous publications focusing on the analysis of the reflow soldering process. Esfandyari et al [1] developed a simulation model using the finite element method to study the optimization relationship between process parameters, simulated thermal processes, and porosity in solder joints of a reflow oven under pressure. Khatibi et al [2] conducted finite element simulations of PbSnAg solder using a stress rate and pressurerelated material model to analyze its stress and strain states under static and cyclic loading conditions.…”

Section: Introductionmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products. In order to improve the product quality during the design process, this paper proposes a robust optimization-based finite element simulation analysis method including significant influencing factor screening, robustness evaluation, robust optimization, and reliability verification for the reflow soldering process. The simulation model of the reflow soldering process temperature field based on experiments is constructed and validated. Sensitivity analysis is used to select important influencing factors, such as the last five set temperature zones (T5 to T9) in the reflow oven and the thermal properties of materials such as PCBs (printed circuit boards), BGAs (ball grid arrays), and solder paste, as well as noise factors like the heating environment during the soldering process. Several surrogate models are used to construct the response surface, and the optimal fitting scheme is selected to effectively avoid poor fitting caused by inappropriate surrogate models. The 6σ robust optimization approach is introduced to evaluate and optimize the robustness of the process design parameter where the heating factor is chosen as the optimization target. The reliability analysis method is employed to validate the product quality. This paper establishes a comprehensive robustness analysis method for hot air reflow soldering, effectively reducing design costs and addressing the lack of robustness analysis in the current hot air reflow soldering process design.

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“…In these cases, a numerical simulation-based approach for the PCBA reflow soldering process has become an important and essential method due to its inherent advantages such as relative short time, low cost and no consumption of the physical products. There are several ways to simulate the reflow soldering process, including the finite element method (FEM) [4], finite volume method (FVM) [5,6], fluid-structure interface (FSI) [7], lattice Boltzmann's method (LBM) [8], discrete phase method (DPM) [9] and molecular dynamic (MD) [10]. Whall et al [11] used ANSYS finite element analysis software to conduct temperature field simulation of 2-D PCBA components and obtained simulated temperature data.…”

Section: Introductionmentioning

confidence: 99%

Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

Xie,

Chen,

Lin

et al. 2023

Symmetry

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The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates the theoretical calculation, numerical simulation and an experimental test to accurately determine the nozzle-matrix gas flow velocity. First, the temperature profile of the aluminum alloy thin plate in convection reflow ovens is measured using a Wiken tester. Second, the nozzle-matrix gas flow velocity is theoretically calculated with the Martin formula. The computational fluid dynamic (CFD)simulation is performed according to the Icepak code, where a single oven chamber model is established to represent the 10 zones of soldering ovens to reduce computational resources considering the supry of the soldering ovens. The simulated temperature profile of the aluminum alloy thin plate is obtained and the specific response surface model (RSM) is established to represent the deviation between the simulated temperature and the measured temperature. Finally, based on reverse problem analysis, non-linear programming by quadratic Lagrangian (NLPQL) is used to solve the mathematical optimization model with the objective of minimizing the temperature deviation to obtain the corrected nozzle-matrix gas flow velocity. To validate the accuracy, the temperature test and the modeling using the corrected gas flow velocity for a new PCBA component for the soldering ovens is conducted separately. The temperature comparison between the simulation and the test shows that the maximum temperature deviation is within 10 °C. This provides evidence that the nozzle-matrix gas flow velocity obtained by the new approach is accurate and effective.

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Simulation, Optimization and Experimental Verification of the Over–Pressure Reflow Soldering Process

Cited by 15 publications

References 8 publications

Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods

Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven

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