Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method

Hui, Xiaoshuang; Ning, Puqi; Fan, Tao; Wang, Kai; Mei, Yunhui; Lei, Guangyin

doi:10.1109/peas58692.2023.10395634

2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) 2023

DOI: 10.1109/peas58692.2023.10395634

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Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method

Xiaoshuang Hui,

Puqi Ning,

Tao Fan

et al.

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Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method

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