2021
DOI: 10.1007/s00170-021-07111-5
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Simulation of the laser-material interaction of ultrashort pulse laser processing of silicon nitride workpieces and the key factors in the ablation process

Abstract: Understanding the laser ablation mechanism is highly essential to find the effect of different laser parameters on the quality of the laser ablation. A mathematical model was developed in the current investigation to calculate the material removal rate and ablation depth. Laser cuts were created on the workpiece with different laser scan speeds from 1 to 10 mm s−1 by an ultrashort pulse laser with a wavelength of about 1000 nm. The calculated depths of laser cuts were validated via practical experiments. The v… Show more

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Cited by 8 publications
(2 citation statements)
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“…Laser ablation is a widely utilized technique in various industrial applications such as laser cutting, 1 laser processing, 2 micro-drilling, 3,4 micro-circuit repair, 5,6 and thin film deposition. 7 It finds extensive application in areas such as machining, [8][9][10] communications, and medical fields.…”
Section: Introductionmentioning
confidence: 99%
“…Laser ablation is a widely utilized technique in various industrial applications such as laser cutting, 1 laser processing, 2 micro-drilling, 3,4 micro-circuit repair, 5,6 and thin film deposition. 7 It finds extensive application in areas such as machining, [8][9][10] communications, and medical fields.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the surface temperature increases as the irradiation time and laser power density increase, reaching a peak value known as T max . This maximum temperature might surpass a phase transformation threshold within the pulse duration, t pulse [4]. A fraction of the laser's energy reaches the surface within the thermal relaxation time, concentrating within a thin layer of material without significant thermal diffusion, leading to electron excitation and subsequent electron heating [5].…”
Section: Introductionmentioning
confidence: 99%