Simulation of temperature dependent materials in high-frequency filters using CST STUDIO SUITE&amp;#x2122;2011

Farina, D.; Hammes, Peter; Thoma, Peter

doi:10.1109/iceaa.2011.6046487

Cited by 3 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Moreover, owing to the linear temperature dependency of metal resistivity, the non-uniform temperature distribution affects the electrical performance of the power delivery network (PDN) and substantially increases the IR drops in the power/ground planes (Bracken et al 2011;Farina et al 2011). In particular, modules that draw more current from the PDN, owing to higher power demands, will suffer worse IR-drop effects.…”

Section: Introductionmentioning

confidence: 99%

Thermal-aware DC IR-drop co-analysis using non-conformal domain decomposition methods

2012

View full text Add to dashboard Cite

Almost all practical engineering applications are multi-physics in nature, and various physical phenomena usually interact and couple with each other. For instance, the resistivity of most conducting metals increases linearly with increases in the surrounding temperature resulting from Joule heating by electrical currents flowing through conductors. Therefore, in order to accurately characterize the performance of high-power integrated circuits (ICs), packages and printed circuit boards (PCBs), it is essential to account for both electrical and thermal effects and the intimate couplings between them. In this paper, we present non-conformal, non-overlapping domain decomposition methods (DDMs) for thermal-aware direct current (DC) IR drop co-analysis of high-power chippackage-PCBs. Here, IR stands for the finite resistivity (R) of metals and current (I) drawn off from the power/ground planes. The proposed DDM starts by partitioning the composite device into inhomogeneous sub-regions with temperature-dependent material properties. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh-generation task for complex ICs can be greatly subdued. The proposed thermal-aware DC IR drop co-analysis applies the non-conformal DDM for both conduction and steady-state heattransfer analyses with a two-way coupling between them. Numerical examples, including an IC package and a chip-package-PCB, demonstrate the flexibility and potential of the proposed thermal-aware DC IR-drop co-analysis using non-conformal DDMs.

show abstract

Section: Introductionmentioning

confidence: 99%