The infrared heating of a vacuum-bagged, thermoplastic prepreg stack of glass/PA66 was studied to investigate the influence of vacuum level on thermal contact resistance between plies. A higher vacuum level was shown experimentally to decrease the transverse heat transfer efficiency, indicating that considering only the effect of heat conduction at the plies interfaces is not sufficient to predict the temperature distribution. An inverse analysis was used to retrieve the contact resistance coefficients as a function of vacuum pressure.