Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Jing, Jianping; Gao, Feng; Johnson, Janine; Liang, Frank Z.; Williams, Richard L.; Qu, Jianmin

doi:10.1115/imece2008-68891

Cited by 12 publications

(4 citation statements)

References 10 publications

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“…The main advantages of micro-Raman spectroscopy are its easy use and its ability to identify

and

crystals [ 15 ]. Digregorio et al used Raman spectroscopy to measure residual stress in the SiC near the surface of the composites and found that the measured decrease in stress with increasing packing fraction is consistent with theoretical predictions based on micromechanics [ 16 ], as with several other relevant studies [ 17 , 18 , 19 , 20 , 21 ].…”

Section: Introductionsupporting

confidence: 64%

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

Tian

Gong

et al. 2018

Materials

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High-temperature phosphate adhesives are widely used in the aerospace and nuclear power industries. However, complex residual stresses can result when the curing temperature parameters are unreasonable due to the brittleness of the adhesive. To reveal the curing temperature mechanism affecting the bonding strength of the phosphate adhesives, several curing temperature curves (CT-1~6) were designed for the single lap joint (SLJ) using phosphate adhesive. The residual stress helped to reveal the relationship between the curing temperature parameters and the bonding performance. In this process, the residual stress of the silicon carbide joint was measured using micro-Raman spectroscopy, and the tensile strength of the joint was tested. A cohesive zone model (CZM) was established with Abaqus® to verify the results, and the numerical results from the model agreed well with the experimental values. The residual stress and adhesive strength were obviously affected by curing temperature. The reasonable curing temperature curves have the benefits of reducing the residual stress and improving the bonding strength.

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“…The main advantages of micro-Raman spectroscopy are its easy use and its ability to identify

and

Section: Introductionsupporting

confidence: 64%

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

Tian

Gong

et al. 2018

Materials

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“…In the current study, the solder ball is still regarded as a homogenous structure in order to simplify the numerical simulation. However, the elastic-plastic deformation of lead-free solder ball was extracted inversely from the experimental force-displacement curve, and more details can be found in [17]. Figure 1b illustrates a typical failure of single solder joint after tensile loading.…”

Section: Methodsmentioning

confidence: 99%

Interfacial failure simulation of single solder joint using a multiscale approach

Gao

Liang

et al. 2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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The interface damage of single solder joint was simulated using cohesive zone model incorporated in finite element analysis. In this study, the solder/IMC/Cu pad interfaces models were constructed for the molecular dynamics simulation. The traction-separation law was derived when the interface model was subjected to a principle strain in one direction. The materials properties of cohesive element for finite element analysis (FEA) were then extracted from the molecular dynamics (MD) calculations. The multiscale simulation results show that the interface damage can be captured well based on the cohesive zone model coupling with MD simulation results, particular when the brittle failure is the dominant mode at the interfaces of single solder joint.

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“…where ‹› is called Macaulay brackets and reflects a zero value for compressive form of t n because compression does not have any effect on the damage initiation phenomenon [24].…”

Section: Damage Initiationmentioning

confidence: 99%

Adhesively bonded aluminium double-strap joints: effects of patch part on failure load

Paygozar

Sadigh

Silva

2020

J Braz. Soc. Mech. Sci. Eng.

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This study aims to predict the failure loads of adhesive double-strap joints (DSJs) with the help of validated finite element (FE) analyses performed in a commercial FE package (ABAQUS/Standard). The damage initiation and propagation in the adhesive was evaluated by a cohesive zone model. The effects of the patch part (i.e. material, length and thickness of the patch) on the failure load of the DSJs joints are investigated. In addition, a stress analysis of the adherends and patch part is performed to provide insights into the stress distribution in the materials, thereby avoiding potential premature or unsuitable failure in the different parts of the joints. It is revealed that the dimensions of the patch can have measurable influences on the failure load and the stress distribution in different parts of the joint which may threaten the suitable performance of the joints. Moreover, the results obtained from the joints with both aluminium and composite straps are almost the same, although considering the weight added to the system, the latter outweighs the other.

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Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Cited by 12 publications

References 10 publications

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

Interfacial failure simulation of single solder joint using a multiscale approach

Adhesively bonded aluminium double-strap joints: effects of patch part on failure load

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