Simulation of a copper micro-wire drawing for electronics

Abstract

The paper discusses the application of the mathematical model of repeated drawing with the sliding of a micro-wire made of copper, intended for the installation of intracircuit electrical connections of microcircuits. Creating production methods and methods for producing microwires based on copper is a complex scientific and technical challenge: only individual firms can produce material that fully meets the needs of the microelectronic industry [1-3]. Therefore, it is necessary to work on the creation of a micro alloyed alloy with rational deformation parameters and providing protection against corrosion damage during micro welding, sealing and operation of devices. The algorithm of the mathematical model applied in the design of drawing transitions is presented. Based on the analysis of the model, recommendations were made for its further improvement in order to increase the reliability of the drawing process with the involvement of process stability criteria. In modelling the technological process of drawing copper, an algorithm developed by the authors for drawing aluminium microwire was used, taking into account the changes needed to make a different material [4–8].

Numerical Modelling and Mechanical Characterization of Pure Aluminium 1050 Wire Drawing for Symmetric and Axisymmetric Plane Deformations

“…The stock is drawn via several dies in series, hence the name multistage wire drawing. Very ductile copper wire is usually a product of such [3]. Wire drawing is done on a multistage drawing machine that is separated by drums spaced at specific lengths in between the dies.…”