Simulation Modeling and Analysis of FBAR RF Filters Considering Different Configurations of Grounding Bond-wires

Yu, Huaiqiang; Deng, Like; Zhang, Lei; Jiang, Mingxin; Ma, Jun; Jiang, Pingying; Tao, Bo; Hu, Shanming

doi:10.1109/apmc52720.2021.9661988

Cited by 2 publications

(1 citation statement)

References 5 publications

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“…SAW filters work less well than FBAR filters in the high-frequency region because of the restrictions on upper frequency (2.5-3 GHz), structure, material, operating mode, quality factor, tolerance, and other factors [1]. The upper frequency of the FBAR filter is as high as 20 GHz, the power capacity is large, the size is small, and the cost is low [3]. FBAR filters are regarded as the ideal GHz band filter devices for a future in which electronic equipment operates at high-frequency bands [4].…”

Section: Introductionmentioning

confidence: 99%

Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package

Tian,

Li,

Zhang

et al. 2023

Micromachines

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On the background that the operating frequency of electronic devices tends to the radio frequency (RF) segment, a film bulk acoustic resonator (FBAR) filter is widely used in communication and military fields because of its advantages of high upper frequency, ample power capacity, small size, and low cost. However, the complex and harsh working environment puts higher requirements for packaging FBAR filters. Based on the Anand constitutive equation, the stress–strain response of the bonded ceramic package was studied by the finite element method for the FBAR filter-bonded ceramic package, and the thermal fatigue life of the device was predicted. We developed solder models with various spillage morphologies based on the random generation technique to examine the impact of spillage on device temperature reliability. The following are the primary conclusions: (1) Solder undergoes periodic deformation, stress, and strain changes throughout the cycle. (2) The corner of the contact surface between the chip and the solder layer has the largest stress at the end of the cycle, measuring 19.377 MPa. (3) The Engelmaier model predicts that the gadget will have a thermal fatigue life of 1928.67 h. (4) Expanding the layered solder area caused by any solder overflow mode may shorten the device’s thermal fatigue life. The thermal fatigue life of a completely spilled solder is higher than that of a partially spilled solder.

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Section: Introductionmentioning

confidence: 99%