2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2016
DOI: 10.1109/ipfa.2016.7564249
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Simulation assisted uncovering and understanding of complex failures in 28nm microprocessor devices

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“…For transistors, we adapt transistor-internal defects to transistor-boundary defects. For example, bad doping causes high impedance at source or drain, which can be modeled by adding high-ohmic resistors at source or drain terminal [23]; corrosion of the gate metallisation or poor gate etching results in a loss of the gate controllability, which can be modeled by gate terminal open [8,9]. By default, opens on source, drain, and gate terminals are considered for transistors.…”
Section: Full Set Of Open-defect Locationsmentioning
confidence: 99%
“…For transistors, we adapt transistor-internal defects to transistor-boundary defects. For example, bad doping causes high impedance at source or drain, which can be modeled by adding high-ohmic resistors at source or drain terminal [23]; corrosion of the gate metallisation or poor gate etching results in a loss of the gate controllability, which can be modeled by gate terminal open [8,9]. By default, opens on source, drain, and gate terminals are considered for transistors.…”
Section: Full Set Of Open-defect Locationsmentioning
confidence: 99%