2014
DOI: 10.1007/s11595-014-1020-6
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Simulation and verification of machining deformation for composite materials

Abstract: Prepreg properties including cure kinetics, cure shrinkage, and coefficient of thermal expansion were analyzed. A simulation method based on "element birth and death" method of Finite element analysis (FEA) was presented to simulate the cutting process and predict the machining deformation for composite laminates and stiffened panels. The comparisons between the simulation results and experimental data showed good agreement. It is found that residual stresses are the main source of machining deformation for co… Show more

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Cited by 7 publications
(6 citation statements)
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“…The material parameters of CYCOM 977‐2 were characterized for the simulation; whereas. those of CYCOM X850 were acquired from Liu et al 32 All the material parameters are summarized in Table 1. Unidirectional composite tensile tests were conducted for mechanical evaluation according to ASTM D3039.…”
Section: Methodsmentioning
confidence: 99%
“…The material parameters of CYCOM 977‐2 were characterized for the simulation; whereas. those of CYCOM X850 were acquired from Liu et al 32 All the material parameters are summarized in Table 1. Unidirectional composite tensile tests were conducted for mechanical evaluation according to ASTM D3039.…”
Section: Methodsmentioning
confidence: 99%
“…Before and after World War II, the evolution of the United States' decolonization policy in East Asia was a process of opposing the old colonial order in Europe and establishing a new colonial order in the United States [5]. The United States uses economic aid and investment to control the economy of Southeast Asian countries and influence the politics of Southeast Asian countries.…”
Section: The Economic Policy Of the United States To The Philippines ...mentioning
confidence: 99%
“…Semiconductor materials such as bismuth telluride (Bi 2 Te 3 ) and antimony telluride (Sb 2 Te 3 ) are promising candidates for TEGs due to their large Seebeck coefficients . Although conducting polymers including polyaniline, epoxy, polyimide (PI), polypyrrole, and poly (3,4‐ethylenedioxythiophene:poly(styrenesulfonate)) have been proposed to fabricate flexible TEGs, their output power density is not sufficient due to their low ZT values and high contact resistance. In order to achieve higher output power density and suppress the heat‐loss through the substrates, organic–inorganic hybrid composite materials and associated coiled‐up structures have been proposed as alternatives for fabricating flexible TEGs .…”
Section: Power Harvesting Devices Utilize Sources From the Human Bodymentioning
confidence: 99%