Simulation and Experimental Study of Non-Resonant Vibration-Assisted Lapping of SiCp/Al

Abstract

SiCp/Al is a difficult-to-machine material that makes it easy to produce surface defects during machining, and researchers focus on reducing the surface defects. Vibration-assisted machining technology is considered an effective method to reduce surface defects by changing the trajectory and contact mode of the abrasive. Aiming at the problem of SiCp/Al processing technology, a vibration-assisted lapping device (VLD) is designed, and elliptical motion is synthesized by a set of parallel symmetrical displacement output mechanisms. The working parameters of the device were tested by simulation and experiment, and the lapping performance was verified. Then, the effects of removal characteristics and process parameters on surface roughness and lapping force were analyzed by simulation and experiment. Simulation and experimental results show that frequency and amplitude that are too low or too high are not conducive to the advantages of NVL. The best surface quality was 54 nm, obtained at A = 8 μm and f = 850 Hz.