Abstract:In this paper, the backward compatibility solder joints were chosen in simulation of perimeter PBGA272 assembly. A double-symmetric plane FE model of a PBGA272 was established using the software ANSYS. Based on the maximum von Mises stress and von Mises strain, the position of the most danger solder joints were obtained under thermal cycle with the temperature condition from -40℃ to 125℃ (JESD22-A104-B Condition G) , Viz. the inner (1#) solder joint and the outside (6#) solder joint are the two key solder join… Show more
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