Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

Zhao, Shengdun; Huang, Chunyue; Tang, Xiang-qiong; Lu, Liangkun

doi:10.1109/icept.2018.8480531

Cited by 6 publications

(4 citation statements)

References 3 publications

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“…Compared with the classic FEA, the method takes into account the process sequence and, hence, can accurately characterize the stress distribution and fluctuation phenomenon of TSVs, which agrees pretty well with X-ray experimental data [9]. Several studies [10][11][12][13] utilized element birth and technique and include simulating sequential processes for ball grid array (BGA) packages, strain distribution in ceramic multilayer capacitors during wave soldering and reflow soldering, phase change of solders, and to further study the residual stress after reflow welding of BGA solder joints. Element birth and death technique was employed to simulate wafer molding process in a continuous manner and warpage during a typical RDL-first (redistribution layer first) fan-out panel level package (FOPLP) process [14][15].…”

Section: Introductionsupporting

confidence: 63%

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Talledo¹

2021

JERR

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Semiconductor packages are commonly assembled and molded in array format on a substrate strip before they are singulated into individual units. However, cumulative substrate expansion causes problems such as machine vacuum error or misaligned cut during singulation if the substrate expansion is not factored in. This study uses element birth and death technique in modeling the overall expansion of the molded substrate strip so that the predicted expansion could be considered in the singulation tooling design offsets. The expansion of the substrate was modeled with the different package assembly processes and thermal conditions. Modeling results showed that there is a cumulative increase in the length of the substrate as it passes through the different processes. The results are in agreement with actual substrate expansion prior to package singulation. This would not be captured when simulation is done only for the molded substrate without considering the cumulative contribution of the preceding processes. With the element birth and death technique in process-based thermomechanical modeling, substrate expansion could already be forecasted, and package assembly problems avoided.

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Section: Introductionsupporting

confidence: 63%

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Talledo¹

2021

JERR

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“…However, some solder balls experience more stress when compared to the others. Previous research conducted by Zhao et al [14] shown that the maximum stress of the solder joint occurs at the edges of the connection with the substrate and PCB. Similarly, the results obtained from the FE simulation shows a greater stress concentration located at the edges of the substrate and PCB.…”

Section: Resultsmentioning

confidence: 97%

“…Meanwhile, the top part experiences stress throughout the area and shows the stress is distributed throughout the whole top area. The stress built up in the solder ball is due to the severe CTE mismatches between the materials solder ball and the PCB/substrate [14]. Not only that, but the critical solder ball is also compressed between the PCB and substrate.…”

Section: Resultsmentioning

confidence: 99%

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

et al. 2022

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Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint.

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“…According to the U.S. Air Force AVIP (Avionics Integrity Program), more than 20% of electronic product failures are attributed to vibration and shock, with solder joint failures being the most common [1,2]. Numerous studies have analyzed the stress and lifespan of solder joints in various environments [3,4,5,6,7,8,9,10,11], with most research utilizing the finite element method to evaluate the impact factors and lifespan of solder joints under vibration [12,13,14,15,16,17,18]. Some studies have also focused on parameter optimization for solder joints [19,20,21,22], employing various optimization methods [23,24,25].…”

Section: Introductionmentioning

confidence: 99%

Stress analysis and optimization of pop package under random vibration loading

Zhang,

Zhu,

Lian

et al. 2023

IEICE Electron. Express

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The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimize the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.

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Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology

Cited by 6 publications

References 3 publications

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Using Element Birth and Death Technique in Modeling Cumulative Molded Substrate Expansion before Singulation

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Stress analysis and optimization of pop package under random vibration loading

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