The peel strength between the aligned carbon nanotubes (ACNTs) and substrate is a critical issue for the structural stability of the ACNTs-based composites. A poor ACNTs-substrate adhesion may cause unreliable and a short service life of the device. In this work, ACNTs are grown on the etched Al foil with largely improved bonding strength by a direct thermal chemical vapor deposition (CVD) synthesis. In the interface part of the ACNTs adjacent to the etched Al substrate, the ACNTs tangled together as 'tiny twine balls' with irregular shape are embedded in the pores of the etched Al foil, similar like the roots of a plant. Such unique structure generates strong bonding strength between as-grown ACNTs and etched Al substrate. The measured peel strength was 76.8 N m-1 compared to the smooth surface Al foil without etching was 53.6 N m-1. Besides, the ACNTs attached to etched Al foil firmly in comparison with the ACNTs have been separated from the smooth surface Al foil after peel strength testing. A 'plant growth' mechanism is proposed to illustrate the growth procedure. When the as-prepared ACNTs/etched Al foil composites are used as supercapacitor (SC) electrodes alone, they deliver the specific capacity (Csp) of 11.3 F g-1. By contrast, after the PANI or MnO2 are post-synthesized on the ACNTs/etched Al substrate, the PANI/ACNTs and MnO2/ACNTs composites can reach a mass-normalized Csp of 488.2 F g-1 and 117.6 F g-1 , respectively. The ACNTs/etched Al foil are also applied as thermal dissipation material for a 24W LED light. The final stable working temperature decreases from 106.3℃ to 82.3℃ and the temperature rise rate between 30℃ and 82℃ decreases from 0.19℃ s-1 to 0.04℃ s-1 after the ACNTs/etched Al foil are stuck to the backboard of LED light. The excellent electrical and outstanding thermal conductivities of ACNTs/etched Al foil composites are mainly attributed to the much higher bonding strength and improved interface contact. The results enlighten and promote the design and preparation of ACNTs composites with high peel strength to develop high-performance electrical and thermal management devices.