Simulation analysis of grinding wheel motion trajectory on SiC ceramics aspheric surface grinding

Abstract

In grinding process of SiC ceramics aspheric surface, the motion trajectory of grinding wheel has great influence on the surface forming. The paper provides mathematical models of grinding wheel movements; analytical simulation was done to describe the trajectories of the grinding wheel in manufacturing an aspherical workpiece. The effect of grinding parameters (including the rotation speed of the workpiece, the feed rate of grinding wheel etc.) on the aspheric surface coverage rate was conducted and discussed in detail. An experimental study was done according to the simulation results and an aspheric surface with form error less than 10μm was gained.