2012
DOI: 10.1016/j.compositesa.2012.08.003
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Simulating the effect of temperature elevation on clamping force requirements during rigid-tool Liquid Composite Moulding processes

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Cited by 26 publications
(44 citation statements)
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“…The preform used for all of the three examples is CSM whose compaction model parameters have been listed in Table 1 22,23,28 and the mold filling parameters are listed in Table 2. The resin injection pressure is 400 kPa for all the three cases, the initial and final cavity thicknesses are 4.4 mm (v f ¼ 0.3977) and 3.5 mm (v f ¼ 0.5), respectively.…”
Section: Numerical Results and Discussionmentioning
confidence: 99%
“…The preform used for all of the three examples is CSM whose compaction model parameters have been listed in Table 1 22,23,28 and the mold filling parameters are listed in Table 2. The resin injection pressure is 400 kPa for all the three cases, the initial and final cavity thicknesses are 4.4 mm (v f ¼ 0.3977) and 3.5 mm (v f ¼ 0.5), respectively.…”
Section: Numerical Results and Discussionmentioning
confidence: 99%
“…Second, the mold is 100 °C and the injection resin is 20 °C at normal temperature. The relationship between mold temperature, injection temperature, and mold internal pressure at different locations: In order to research the efficiency of raising mold and injection temperature on reducing the mold internal pressure, 81 groups of simulation results at different locations were carried out from 20 to 100 °C by 10 °C each time to draw “T(Mold temperature)‐T(Injection temperature)‐P(Pressure)” curve. The effect of mold temperature and injection temperature on the overall mold internal pressure: In order to research the effect of temperature on the overall mold internal pressure, a mold force F fluid which is the force exerted on the mold platens due to resin pressure generated within the mold was introduced. The equation of the F fluid is shown as Ffluid=CSPfluiditalicdS where P fluid is the mold internal pressure at different positions, S is the area of the mold wall on each element.…”
Section: Methodology Of Simulation and Researchmentioning
confidence: 99%
“…The mold internal pressure and filling time can be reduced by optimizing the position of injection/vent port, but the position of injection/vent port is limited by the shape of the products and sometimes cannot be optimized. Meanwhile, an effective way to reduce mold pressure is to reduce the viscosity of the resin by heating the mold and injection resin . Since RTM process is nonisothermal, the effect of temperature on RTM is very complicated, especially considering heat transfer, curing reaction of the resin, and heat release during curing reaction …”
Section: Introductionmentioning
confidence: 99%
“…While the RTM and I/C-LCM cycles possess some distinct variables, they also possess a set of baseline variables that appear in the phenotype spaces of both processes [46]. This overlap stems from the fact that both procedures belong to the same family of LCM methods.…”
Section: Partial Overlap In Phenotype Spacementioning
confidence: 98%
“…13. The candidate processes are (a) resin transfer molding (RTM) [45,46] and (b) injection/compression liquid composite molding (I/C-LCM) [45][46][47].…”
Section: Partial Overlap In Phenotype Spacementioning
confidence: 99%