2007
DOI: 10.1016/j.nimb.2007.04.296
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SIMS analyses of ultra-low-energy B ion implants in Si: Evaluation of profile shape and dose accuracy

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Cited by 18 publications
(10 citation statements)
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“…The SIMS profiles of phosphorus were analyzed using a point-topoint correction protocol [9] because the ion yield and sputtering rate in the oxide layer are different from that in bulk silicon. Quantitative analysis of dopants near the surface is difficult for SIMS because ion reactions are not in equilibrium.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The SIMS profiles of phosphorus were analyzed using a point-topoint correction protocol [9] because the ion yield and sputtering rate in the oxide layer are different from that in bulk silicon. Quantitative analysis of dopants near the surface is difficult for SIMS because ion reactions are not in equilibrium.…”
Section: Resultsmentioning
confidence: 99%
“…Redistribution of phosphorus and carbon was measured by secondary ion mass spectrometry (SIMS) at Evans Analytical Group using Cs as the primary ion source. A point-by-point corrected profile protocol [9] was used to obtain the depth profiles of phosphorus. X-ray photoelectron spectroscopy (XPS) was performed to monitor phosphorus redistribution near the surface region.…”
Section: Methodsmentioning
confidence: 99%
“…This has been accomplished by various groups using techniques such as medium-energy ion scattering (MEIS) or high-resolution Rutherford backscattering (HR-RBS). 99 One group has even proposed using reactive ion etching to further reduce impact energy. 100 With the advent of FinFET and other 3D devices, techniques such as atom probe or scanning spreading resistance microscopy (SSRM) may be more suited for dopant characterisation as the planar implant profile is no longer representative of doping on sidewalls of devices.…”
Section: Microelectronicsmentioning
confidence: 99%
“…Dopant profiles were measured by secondary ion mass spectroscopy (SIMS) using Point-by-point Correction technology (PCOR-SIMS SM ) developed by Evans Analytical Group. This methodology has a depth resolution of 0.5 nm, and is designed specifically 25 to avoid the spurious appearance of dopant pile-up that traditional SIMS often yields [26][27][28] within the first few nanometers of the surface. SIMS was performed with any native or grown oxide from the annealing step left in place, and the oxygen signal was monitored to identify the location of the Si-SiO 2 interface.…”
mentioning
confidence: 99%