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2012
DOI: 10.1007/s12613-012-0683-2
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Simple point contact WO3 sensor for NO2 sensing and relevant impedance analysis

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Cited by 9 publications
(10 citation statements)
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“…This unpaired electron in the N atom of NO 2 forms bond with the surface oxygen of WO 3 and subsequently promote the chemisorption. [41]. Thus response towards NO 2 is higher than other gases at moderately low operating temperature.…”
Section: A C C E P T E D Accepted Manuscriptmentioning
confidence: 86%
“…This unpaired electron in the N atom of NO 2 forms bond with the surface oxygen of WO 3 and subsequently promote the chemisorption. [41]. Thus response towards NO 2 is higher than other gases at moderately low operating temperature.…”
Section: A C C E P T E D Accepted Manuscriptmentioning
confidence: 86%
“…Additional advantage related to the assessment of initial kinetics compared to the evaluation of steady-state signal is based on specific features of chemical reactions, which occur during catalytic oxidation based sensing of some here evaluated VOC [46]. Different from the general scheme represented in the Introduction (Equation 7), these reactions proceed through several distinct steps, which are presented below in Equations (12)(13)(14)(15)(16)(17). At higher than room temperatures in the presence of air the majority of gas-or VOC-molecules, which are adsorbed on the metal oxide-based surfaces, are oxygen species (O − ) [47,48].…”
Section: Resultsmentioning
confidence: 99%
“…When oxygen species are reacting with the reducing organic compounds, then the injection of electrons is narrowing 'the width' of the electron depletion layer, which is leading to the decrease in resistance of sensing layer. Corresponding chemical reactions between analyte-molecules and oxygen species are presented in Equations (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15) [51,52].…”
Section: Resultsmentioning
confidence: 99%
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“…Many synthesis procedures have been proposed for producing the WO 3 films for NO and NO 2 sensors. These include spray pyrolysis [31], drop coating [32], co-precipitation [33], sol-gel synthesis [20], plasma-enhance chemical vapor deposition (PECVD) [34], thermal evaporation [13,35], and glancing angle DC magnetron sputtering [36]. In order to have a high productivity, low resistance, and a low power consumption sensor, the current trend is to construct all sensing elements on a chip [37].…”
Section: Introductionmentioning
confidence: 99%