Simple planar magnetron sputtering source

The present study deals with the design aspects of planar magnetron sputtering targets. A permanent ring magnet with modified pole piece geometry has been used for maximum ionization efficiency. The efficiency of electron containment on the target surface has been evaluated in terms of current at the electrically isolated substrates. The details of the relation between the magnetic field strength and field geometry on the ionization currents and operating pressure have been discussed. The best among the designs studied, when operated at a pressure of 8 X 10 -3 Torr resulted in a deposition rate of about 2000 Almin at a current density of 4 mAl cm 2 . The substrate temperature rise was about 20°C under these conditions. The design details of the magnetrons, experimentation for evaluating the electron containment have been discussed in this article.

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“…Rastogi et al 8 used V-shaped permanent magnets outside the vacuum chamber. Different magnet configurations have been used in this endeavor.…”

Section: Introductionmentioning

confidence: 99%

Optimization studies on magnetic field geometry for planar magnetron sputtering targets

Rao

Mohan

1991

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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“…(a) Schematic diagram of the magnetron sputtering source with an inductively coupled rf plasma [28]. (a) Schematic diagram of the magnetron sputtering source with an inductively coupled rf plasma [28].…”

mentioning

confidence: 99%