Simple Modification of Sheet Resistivity of Conducting Polymeric Anodes via Combinatorial Ink‐Jet Printing Techniques

Yoshioka, Yuka; Calvert, Paul; Jabbour, Ghassan E.

doi:10.1002/marc.200400527

Cited by 111 publications

(81 citation statements)

References 43 publications

(38 reference statements)

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“…Ink-jet printing has also been successfully used to screen and optimize polymeric materials for organic light-emitting diodes and other optoelectronic device applications. [185][186][187] ZnO is a versatile wide bandgap semiconductor material; to date, a variety of devices including light emitting pnjunctions, lasers, gas sensors, and photodetectors have been demonstrated using ZnO and related compounds. 188 The combinatorial approach has proven to be an effective way to help expand the utility of this material.…”

Section: -23mentioning

confidence: 99%

Applications of high throughput (combinatorial) methodologies to electronic, magnetic, optical, and energy-related materials

Green

Takeuchi

Hattrick‐Simpers

2013

Journal of Applied Physics

224

189

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High throughput (combinatorial) materials science methodology is a relatively new research paradigm that offers the promise of rapid and efficient materials screening, optimization, and discovery. The paradigm started in the pharmaceutical industry but was rapidly adopted to accelerate materials research in a wide variety of areas. High throughput experiments are characterized by synthesis of a "library" sample that contains the materials variation of interest (typically composition), and rapid and localized measurement schemes that result in massive data sets. Because the data are collected at the same time on the same "library" sample, they can be highly uniform with respect to fixed processing parameters. This article critically reviews the literature pertaining to applications of combinatorial materials science for electronic, magnetic, optical, and energy-related materials. It is expected that high throughput methodologies will facilitate commercialization of novel materials for these critically important applications. Despite the overwhelming evidence presented in this paper that high throughput studies can effectively inform commercial practice, in our perception, it remains an underutilized research and development tool. Part of this perception may be due to the inaccessibility of proprietary industrial research and development practices, but clearly the initial cost and availability of high throughput laboratory equipment plays a role. Combinatorial materials science has traditionally been focused on materials discovery, screening, and optimization to combat the extremely high cost and long development times for new materials and their introduction into commerce. Going forward, combinatorial materials science will also be driven by other needs such as materials substitution and experimental verification of materials properties predicted by modeling and simulation, which have recently received much attention with the advent of the Materials Genome Initiative. Thus, the challenge for combinatorial methodology will be the effective coupling of synthesis, characterization and theory, and the ability to rapidly manage large amounts of data in a variety of formats. V C 2013 AIP Publishing LLC. [http://dx

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Section: -23mentioning

confidence: 99%

Applications of high throughput (combinatorial) methodologies to electronic, magnetic, optical, and energy-related materials

Green

Takeuchi

Hattrick‐Simpers

2013

Journal of Applied Physics

224

189

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“…1,2 To date, a variety of device fabrication methods using this technique have been proposed, including those for the fabrication of electrooptic devices, 35 gas sensors, 68 electrochromic devices (ECDs), 9 interconnections for circuitry on a printed-circuit board (PCB), 10 thin-film transistors (TFTs), 11 organic light-emitting diodes (OLEDs), 12 large-area displays, 13 and radio frequency identification (RFID) tags. 14,15 For patterning electrodes and wires of the devices, metal nanoparticles, such as Au, 1517 Ag, 18,19 and Cu 20,21 have been studied as promising ink particles, since the particles exhibit good dispersibility in solvents through coating of the particle surfaces with organic monolayers, and they form flexible films with high metal content after being cured.…”

Section: ¹1mentioning

confidence: 99%

Gold-nanoparticle Inks for Room-temperature Formation of Conductive Films

2012

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We show that aqueous inks containing Au nanocrystals that were slightly modified with mercaptosuccinic acid (MSA, IUPAC name: sulfanylsuccinic acid) turn into conductive films after being cured in room-temperature air. Because of the highly hydrophilic nature of MSA, the nanoparticles maintain good dispersion in water. The conductive film exhibits an electrical resistivity in the order of 10 ¹5 ³ cm, and its temperature coefficient in the range from 290 to 20 K was 7 © 10 ¹5

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“…In recent years, considerable progress has been made in fabricating electronic circuits/circuit components using this method. [1][2][3][4] Development of inks with low sintering temperatures, such as nanoparticle-based silver ink, has resulted in widespread research activity in this field.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Same

Sridhar

Perik

Reiding

et al. 2009

Transactions of The Japan Institute of Electronics Packaging

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This paper describes the optimisation of the surface characteristics of a high-frequency substrate material widely used in the PCB (printed circuit board) industry by means of CF 4 /O 2 plasma etching, in order to make it suitable for the fabrication of RF (radio frequency) circuit structures by a combination of inkjet printing and electroless plating. A statistical DoE (design of experiments) based on a CCRD (central composite rotatable design) was used to systematically vary the plasma etching parameters and explore the characteristics of the etching process. This experimental design yielded 31 substrates, all of which were assessed in terms of surface energy, surface roughness and adhesion. Out of these substrates, 5 were identified as having the most favourable surface characteristics. Finally, RF circuit structures in the form of S-band filters were fabricated on these substrates using an inkjet printing-electroless plating combination, and the RF performance of these structures was characterised and compared.

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Simple Modification of Sheet Resistivity of Conducting Polymeric Anodes via Combinatorial Ink‐Jet Printing Techniques

Cited by 111 publications

References 43 publications

Applications of high throughput (combinatorial) methodologies to electronic, magnetic, optical, and energy-related materials

Applications of high throughput (combinatorial) methodologies to electronic, magnetic, optical, and energy-related materials

Gold-nanoparticle Inks for Room-temperature Formation of Conductive Films

Fabrication of RF Circuit Structures on a PCB Material Using Inkjet Printing-Electroless Plating and the Substrate Preparation for the Same

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