Simple design for Seebeck measurement of bulk sample by 2-probe method concurrently with electrical resistivity by 4-probe method in the temperature range 300–1000 K

Rawat, P. K.; Paul, Biplab

doi:10.1016/j.measurement.2016.05.104

Cited by 13 publications

(8 citation statements)

References 47 publications

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“…Its transport properties are important and closely related with each other [8,9] and, thus, extensive studies are reported for Pt at ambient pressure [10][11][12][13][14][15][16][17][18][19][20][21][22][23]. For example, the electrical resistivity, the Seebeck coefficient, and the thermal conductivity are reported to be 10.87 μ cm, −5.28 μV/K, and 71.6 W m −1 K −1 at 300 K, respectively [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…By using K n , the electrical resistivity ρ, the Seebeck coefficient S, and the thermal conductivity k can be calculated as follows, [10], the Seebeck coefficient [11], the thermal conductivity [12], and the Lorenz number [10,12]. Cross symbols are previous experiments of resistivity [13,14,[16][17][18][19], Seebeck coefficient [15][16][17]20,21], and thermal conductivity measurements [14,18,22,23]. Open gray circles indicate the previous calculation [33].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Resistivity, Seebeck coefficient, and thermal conductivity of platinum at high pressure and temperature

Gomi

Yoshino

2019

Phys. Rev. B

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Platinum (Pt) is one of the most widely used functional materials for high-pressure and high-temperature experiments. Despite the crucial importance of its transport properties, both experimental and theoretical studies are very limited. In this study, we conducted density functional theory calculations on the electrical resistivity, the Seebeck coefficient, and the thermal conductivity of solid face-centered cubic Pt at pressures up to 200 GPa and temperatures up to 4800 K by using the Kubo-Greenwood formula. The thermal lattice displacements were treated within the alloy analogy, which is represented by means of the Korringa-Kohn-Rostoker method with the coherent potential approximation. The electrical resistivity decreases with pressure and increases with temperature. These two conflicting effects yield a constant resistivity of ∼70 μ cm along the melting curve. Both pressure and temperature effects enhance the thermal conductivity at low temperatures, but the temperature effect becomes weaker at high temperatures. Although the pressure dependence of the Seebeck coefficient is negligibly small at temperatures below ∼1500 K, it becomes larger at higher temperatures. It requires a calibration of a thermocouple such as Pt-Rh in high-pressure and-temperature experiments.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Resistivity, Seebeck coefficient, and thermal conductivity of platinum at high pressure and temperature

Gomi

Yoshino

2019

Phys. Rev. B

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“…is effect, however, is not observed for induction soldered joints. Recently, Rawat and Paul measured the electrical resistivities of Pt [33] and Kim et al measured the resistivity of the Sn-Ag-Al alloy by four-probe method [34].…”

Section: Characterization Of Solder Jointsmentioning

confidence: 99%

Properties of Sn‐Ag‐Cu Solder Joints Prepared by Induction Heating

Drienovský

Palcut

Priputen

et al. 2020

Advances in Materials Science and Engineering

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In the present work, one near-eutectic and three hypoeutectic Sn-Ag-Cu alloys have been employed for soldering by induction heating. The alloys were produced by induction melting of high purity Ag, Cu, and Sn lumps. The melting behavior of the alloys was investigated by differential scanning calorimetry. The solder alloys were subsequently applied for soldering by conventional hot-plate heating as well as induction heating and both soldering times and peak temperatures were recorded during soldering. Solder joints of two copper sheets were produced. The electrical resistance, tensile strength, and microstructure were analyzed on each soldered joint. The results indicate that the physical and mechanical properties of solder joints are determined by their chemical composition and soldering technology. Induction soldered joints not only have a slightly higher electrical resistivity but also higher mechanical strength, except of the 0.3 wt.% Ag hypoeutectic solder. The highest increase in ultimate tensile strength (28%) was observed for induction soldered joints with 1 wt.% Ag hypoeutectic solder. This effect is ascribed to the homogenous distribution of the intermetallic compounds within the eutectic in the alloy microstructure. The homogenous distribution is aided by rotation of liquid solder due to eddy currents and high-frequency magnetic field generated during induction heating.

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“…Among them, the four-probe method is the most widely used resistivity measurement method in the semiconductor production process. The four-probe method (4,5) is a simple means of measuring small samples and analyzing their inhomogeneity. However, the position of the probe requires manual adjustment.…”

Section: Introductionmentioning

confidence: 99%

Accurate Sheet Resistivity Measurement Based on Image Reconstruction Using Improved Node-back-projection Algorithm

Liu¹,

Qianwen²,

Lin³

et al. 2019

Sensors and Materials

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Currently, electrical impedance tomography (EIT) is widely used in sheet resistivity measurement of silicon wafers. The reconstruction of a resistivity image by electrical impedance imaging usually uses a four-probe measurement method. However, it may cause some loss of data and result in inaccurate outcomes. To resolve this problem, in this paper, we propose an improved node-back-projection algorithm by integrating the pseudomeasurement principle. High-resolution resistivity images can therefore be obtained quickly without damaging the silicon wafer. The resistivity contour map is then formed to identify the resistivity distribution. Accordingly, the positions of defects in the silicon wafer can be determined from the measured image, making the quality of silicon-wafer-based chips more reliable. The experimental results verify that the proposed algorithm is superior in terms of precision, reliability, and speed.

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Simple design for Seebeck measurement of bulk sample by 2-probe method concurrently with electrical resistivity by 4-probe method in the temperature range 300–1000 K

Cited by 13 publications

References 47 publications

Resistivity, Seebeck coefficient, and thermal conductivity of platinum at high pressure and temperature

Resistivity, Seebeck coefficient, and thermal conductivity of platinum at high pressure and temperature

Properties of Sn‐Ag‐Cu Solder Joints Prepared by Induction Heating

Accurate Sheet Resistivity Measurement Based on Image Reconstruction Using Improved Node-back-projection Algorithm

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