2007
DOI: 10.1016/j.tsf.2007.02.106
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Simple bond energy approach for non-destructive measurements of the fracture toughness of brittle materials

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Cited by 30 publications
(17 citation statements)
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“…These few examples show that an efficient packing (large C g ) might compensate a weak bonding energy and vice‐versa, and that a minimum surface energy estimation is in agreement with the experimental values. A simple bond energy approach of fracture toughness was already proposed by previous authors for brittle materials. In this former study the surface energy for the fracture of crystalline solids was calculated for various crystallographic orientation using the actual lattice constants and the relevant bond dissociation energies.…”
Section: Dependence On the Glass Atomic Structure And Compositionmentioning
confidence: 99%
“…These few examples show that an efficient packing (large C g ) might compensate a weak bonding energy and vice‐versa, and that a minimum surface energy estimation is in agreement with the experimental values. A simple bond energy approach of fracture toughness was already proposed by previous authors for brittle materials. In this former study the surface energy for the fracture of crystalline solids was calculated for various crystallographic orientation using the actual lattice constants and the relevant bond dissociation energies.…”
Section: Dependence On the Glass Atomic Structure And Compositionmentioning
confidence: 99%
“…1,12 Perhaps the most prominent example is the concomitant decrease in Young's modulus and fracture toughness that is accompanied by the introduction of increasing levels of nano-porosity in low-k ILD materials. [13][14][15][16][17][18] The reduction in these mechanical properties can lead to mechanical failure (cracking and delamination) 19,20 during down stream processing steps such as Cu chemical mechanical planarization (CMP) and/or packaging. 12,13,21 The introduction of nano-porosity has also been noted to degrade the electrical properties of low-k materials including increased leakage currents, decreased breakdown voltages (V bd ), and shortened times for time dependent dielectric breakdown failures (TDDB).…”
mentioning
confidence: 99%
“…However, for an anisotropic material with strong texture, G C may be orientation dependent. King and Antonelli [46] indicated that G C is strongly associated with the number of broken bonds and crystal density. For ZrN, fracture on (111) plane should break more bonds than on (220) or (200) planes, and therefore G C on (111) is expected to be larger than that on (220) or (200).…”
Section: Effect Of Texture On Fracture Toughnessmentioning
confidence: 99%
“…For ZrN, fracture on (111) plane should break more bonds than on (220) or (200) planes, and therefore G C on (111) is expected to be larger than that on (220) or (200). From broken bond theory [46], taking bonding energy (E b,ZrN 0 ) of ZrN to be 565 ± 25 kJ/mol [47], G C of ZrN at different orientations can be calculated as G C,(200) = 17.9 ± 0.8 J/m 2 , G C,(220) = 25.3 ± 1.2 J/m 2 , and G C,(111) = 41.4 ± 1.9 J/m 2 , indicating that G C is orientation dependent. Similar computational results were reported by Bielawski and Chen [48].…”
Section: Effect Of Texture On Fracture Toughnessmentioning
confidence: 99%